NTE4066B & NTE4066BT
Integrated Circuit
CMOS, Quad Bilateral Switch
Description:
The NTE4066B (14−Lead DIP) and NTE4066BT (SOIC−14) are integrated circuits consisting of
four independent switches capable of controlling either digital or analog signals. These quad bilateral
switches are useful in signal gating, chopper, modulator, demodulator, and CMOS logic implementa-
tion.
The NTE4066B/BT is designed to be pin−for−pin compatible with the NTE4016B/BT, but has much
lower ON resistance. Input voltage swings as large as the full supply voltage can be controlled via
each independent control input.
Features:
D Triple Diode Protection on All Control Inputs
D Supply Voltage Range: 3V to 18V
D Linearized Transfer Characteristics
D Low Noise: 12nV/pCycle, f ≥ 1kHz typical
Absolute Maximum Ratings: (Voltages Referenced to VSS, Note 1, Note 2)
DC Supply Voltage, VDD . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 to +18.0V
Input Voltage (DC or Transient), Vin . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 to VDD to +0.5V
Output Voltage (DC or Transient), Vout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 to VDD to +0.5V
Input Current (DC or Transient, Per Pin), Iin . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10mA
Output Current (DC or Transient, Per Pin), Iout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10mA
Switch Through Current, ISW . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25mA
Power Dissipation (Per Package), PD . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 500mW
Temperature Derating (from +65° to +125°C) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −7.0mW/°C
Ambient Temperature Range, TA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −55° to +125°C
Storage Temperature Range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −65° to +150°C
Lead Temperature (During Soldering, 8sec max), TL . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +260°C
Note 1. Stresses exceeding maximum Ratings may damage the device. Maximum Ratings are
stress ratings only. Functional operation above the Recommended Operating Conditions is
not implied. Extended exposure to stresses above the Recommended Operating Conditions
may affect device reliability.
Note 2. These devices contain protection circuitry to guard against damage due to high static
voltages or electric fields. However, precautions must be taken to avoid applications of any
voltage higher than maximum rated voltages to this high−impedance circuit. For proper op-
eration, Vin and Vout should be constrained to the range VSS ≤ (Vin or Vout) ≤ VDD.
Unused inputs must always be tied to an appropriate logic voltage level (e.g. eiher VSS, VEE
or VDD), Unused outputs must be left open.