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NTE3001 PDF预览

NTE3001

更新时间: 2024-09-15 22:50:55
品牌 Logo 应用领域
NTE 二极管
页数 文件大小 规格书
2页 22K
描述
Light Emitting Diode Miniature, Diffused Red

NTE3001 技术参数

是否无铅: 含铅是否Rohs认证: 符合
生命周期:ActiveReach Compliance Code:compliant
HTS代码:8541.40.20.00风险等级:5.71
其他特性:IC COMPATIBLE, HIGH RELIABILITY颜色:RED
颜色@波长:Red配置:SINGLE
最大正向电流:0.04 A最大正向电压:1.6 V
JESD-609代码:e0透镜类型:DIFFUSED
标称发光强度:1 mcd安装特点:AXIAL MOUNT
功能数量:1端子数量:2
最高工作温度:100 °C最低工作温度:-55 °C
光电设备类型:SINGLE COLOR LED总高度:2.42 mm
包装方法:BULK峰值波长:660 nm
形状:ROUND尺寸:1.96 mm
子类别:Visible LEDs表面贴装:NO
T代码:T-3/4端子面层:Tin/Lead (Sn/Pb)
视角:80 degBase Number Matches:1

NTE3001 数据手册

 浏览型号NTE3001的Datasheet PDF文件第2页 
NTE3001  
Light Emitting Diode  
Miniature, Diffused Red  
Description:  
The NTE3001 is a diffused Gallium Arsenide Phosphide diode mounted in a two lead epoxy package  
with a red diffused lens. On forward bias, this device emits a spectrally narrow band of visible light  
which peaks at 660nm.  
The NTE3001 is intended for high volume indicator light applications where low cost, high reliability,  
and top performance are required. Major usage is in applications such as diagnostic lights on printed  
circuit boards and panel lights. This device can be used to displace subminiature lamps as small as  
T3/4 size.  
Features:  
D Low Cost  
D Bright  
D Compatible with Integrated Circuits  
D Long Life, Rugged  
D Small Size: T–3/4  
D Easily Assembled in Arrays  
Absolute Maximum Ratings:  
Power Dissipation (TA = +25°C) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 80mW  
Derate linearly from 25°C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.6mW/°C  
Forward Current  
Continuous . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40mA  
Peak (1µsec pulse width, 0.3% duty cycle) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.0A  
Reverse Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5.0V  
Operating Temperature Range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –55° to 100°C  
Storage Temperature Range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –55° to 100°C  
Lead Temperature (During Soldering, 5sec max, Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +230°C  
Typical Thermal Characteristics:  
Wavelength Temperature Coefficient (Case Temperature) . . . . . . . . . . . . . . . . . . . . . . . . . . 0.3nm/°C  
Forward Voltage Temperature Coefficient . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –2.0mV/°C  
Note 1. The leads of the device were immersed in molten solder at +230°C to a point 1/16 inch from  
the body of the device with a dwell time of 5 seconds.  

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