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NTE2900 PDF预览

NTE2900

更新时间: 2024-11-01 22:49:51
品牌 Logo 应用领域
NTE 晶体开关晶体管功率场效应晶体管
页数 文件大小 规格书
3页 32K
描述
MOSFET N-Ch, Enhancement Mode High Speed Switch

NTE2900 技术参数

生命周期:Active包装说明:,
Reach Compliance Code:unknownECCN代码:EAR99
风险等级:5.75配置:Single
最大漏极电流 (Abs) (ID):14 AFET 技术:METAL-OXIDE SEMICONDUCTOR
最高工作温度:175 °C极性/信道类型:N-CHANNEL
最大功率耗散 (Abs):125 W子类别:FET General Purpose Power
表面贴装:NOBase Number Matches:1

NTE2900 数据手册

 浏览型号NTE2900的Datasheet PDF文件第2页浏览型号NTE2900的Datasheet PDF文件第3页 
NTE2900  
MOSFET  
N–Ch, Enhancement Mode  
High Speed Switch  
Features:  
D Dynamic dv/dt Rating  
D Repetitive Avalanche Rated  
D Fast Switching  
D Ease of Paralleling  
D Simple Drive Requirements  
Absolute Maximum Ratings:  
Continuous Drain Current (VGS = 10V), ID  
TC = +25°C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14A  
TC = +100°C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8.5A  
Pulsed Drain Current (Note 1), IDM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 56A  
Power Dissipation (TC = +25°C), PD . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 125W  
Derate Linearly Above 25°C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.0W/°C  
Gate–to–Source Voltage, VGS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±20  
Single Pulse Avalanche Energy (Note 2), EAS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 550mJ  
Avalanche Current (Note 1), IAR . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14A  
Repetitive Avalanche Energy (Note 1), EAR . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13mJ  
Peak Diode Recovery dv/dt (Note 3), dv/dt . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4.8V/ns  
Operating Junction Temperature Range, TJ . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –55° to +175°C  
Storage Temperature Range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –55° to +175°C  
Lead Temperature (During Soldering, 1.6mm from case for 10sec), TL . . . . . . . . . . . . . . . . . +300°C  
Mounting Torque (6–32 or M3 Screw) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 lbfin (1.1Nm)  
Thermal Resistance, Junction–to–Case, RthJC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.0°C/W  
Thermal Resistance, Junction–to–Ambient, RthJA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 62°C/W  
Typical Thermal Resistance, Case–to–Sink (Flat, Greased Surface), RthCS . . . . . . . . . . . . 0.5°C/W  
Note 1. Repetitive rating; pulse width limited by maximum junction temperature.  
Note 2. VDD = 25V, starting TJ = +25°C, L = 4.5mH, RG = 25, IAS = 14A  
Note 3. ISD 14A, di/dt 150A/µs, VDD 250V, TJ +175°C  
Note 4. Pules Width 300µs, Duty Cycle 2%.  

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