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NTE2633 PDF预览

NTE2633

更新时间: 2024-11-01 22:49:51
品牌 Logo 应用领域
NTE 晶体射频双极晶体管驱动放大器局域网
页数 文件大小 规格书
2页 24K
描述
Silicon Complementary Transistors High Frequency Video Driver

NTE2633 技术参数

生命周期:Active包装说明:FLANGE MOUNT, R-PSFM-T3
Reach Compliance Code:unknownECCN代码:EAR99
风险等级:1.99最大集电极电流 (IC):0.3 A
基于收集器的最大容量:2 pF集电极-发射极最大电压:95 V
配置:SINGLE最小直流电流增益 (hFE):20
最高频带:HIGH FREQUENCY BANDJEDEC-95代码:TO-126
JESD-30 代码:R-PSFM-T3元件数量:1
端子数量:3最高工作温度:175 °C
封装主体材料:PLASTIC/EPOXY封装形状:RECTANGULAR
封装形式:FLANGE MOUNT极性/信道类型:NPN
最大功率耗散 (Abs):3 W认证状态:Not Qualified
子类别:Other Transistors表面贴装:NO
端子形式:THROUGH-HOLE端子位置:SINGLE
晶体管应用:AMPLIFIER晶体管元件材料:SILICON
标称过渡频率 (fT):1200 MHzBase Number Matches:1

NTE2633 数据手册

 浏览型号NTE2633的Datasheet PDF文件第2页 
NTE2633 (NPN) & NTE2634 (PNP)  
Silicon Complementary Transistors  
High Frequency Video Driver  
Description:  
The NTE2633 (NPN) and NTE2634 (PNP) are silicon complementary epitaxial transistor in a TO126  
type package designed for use in the buffer stage of the driver for high–resolution color graphics moni-  
tors.  
Features:  
D High Breakdown Voltage  
D Low Output Capacitance  
Absolute Maximum Ratings:  
Collector–Base Voltage, VCBO . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 115V  
Collector–Emitter Voltage, VCEO . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 95V  
Collector–Emitter Voltage (RBE = 100), VCER . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 110V  
Emitter–Base Voltage, VEBO . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3V  
DC Collector Current, IC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 300mA  
Total Power Dissipation (TS +115°C, Note 1), Ptot . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3W  
Operating Junction Temperature, TJ . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +175°C  
Storage Temperature Range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –65° to +175°C  
Thermal Resistance, Junction–to–Soldering Point (TS +115°C, Note 1), RthJS . . . . . . . . . 20K/W  
Note 1. TS is the temperature at the soldering point of the collector lead.  
Electrical Characteristics: (TJ = +25°C unless otherwise specified)  
Parameter  
Symbol  
Test Conditions  
Min Typ Max Unit  
Collector–Base Breakdown Voltage  
Collector–Emitter Breakdown Voltage  
V
I = 0.1mA  
115  
95  
110  
3
V
V
V
V
(BR)CBO  
(BR)CEO  
(BR)CER  
(BR)EBO  
C
V
V
V
I = 10mA  
C
I = 10mA, R = 100  
C
BE  
Emitter–Base Breakdown Voltage  
Collector Cutoff Current  
I = 0.1mA  
E
I
I = 0, V = 50V  
100 µA  
CES  
B
CE  
I
I = 0, V = 50V  
20  
µA  
CBO  
E
CB  
DC Current Gain  
h
I = 50mA, V = 10V, T = +25°C  
20  
35  
FE  
C
CE  
A
Transition Frequency  
f
I = 50mA, V = 10V, f = 100MHz,  
A
0.8 1.2  
GHz  
pF  
T
C
CE  
T = +25°C  
Collector–Base Capacitance  
C
I = 0, V = 10V, f = 1MHz, T = +25°C  
2.0  
cb  
C
CB  
A

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