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NTD85N02RT4G PDF预览

NTD85N02RT4G

更新时间: 2024-09-13 22:19:59
品牌 Logo 应用领域
安森美 - ONSEMI 晶体晶体管功率场效应晶体管开关脉冲
页数 文件大小 规格书
10页 77K
描述
Power MOSFET 85 Amps, 24 Volts N-Channel DPAK

NTD85N02RT4G 技术参数

是否无铅: 不含铅生命周期:End Of Life
包装说明:LEAD FREE, CASE 369AA, DPAK-3针数:4
Reach Compliance Code:not_compliantECCN代码:EAR99
Factory Lead Time:1 week风险等级:5.18
雪崩能效等级(Eas):85 mJ外壳连接:DRAIN
配置:SINGLE WITH BUILT-IN DIODE最小漏源击穿电压:24 V
最大漏极电流 (Abs) (ID):12 A最大漏极电流 (ID):85 A
最大漏源导通电阻:0.0052 ΩFET 技术:METAL-OXIDE SEMICONDUCTOR
JESD-30 代码:R-PSSO-G2JESD-609代码:e3
湿度敏感等级:1元件数量:1
端子数量:2工作模式:ENHANCEMENT MODE
最高工作温度:150 °C封装主体材料:PLASTIC/EPOXY
封装形状:RECTANGULAR封装形式:SMALL OUTLINE
峰值回流温度(摄氏度):260极性/信道类型:N-CHANNEL
最大功率耗散 (Abs):78.1 W最大脉冲漏极电流 (IDM):192 A
认证状态:Not Qualified子类别:FET General Purpose Power
表面贴装:YES端子面层:Tin (Sn)
端子形式:GULL WING端子位置:SINGLE
处于峰值回流温度下的最长时间:40晶体管应用:SWITCHING
晶体管元件材料:SILICONBase Number Matches:1

NTD85N02RT4G 数据手册

 浏览型号NTD85N02RT4G的Datasheet PDF文件第2页浏览型号NTD85N02RT4G的Datasheet PDF文件第3页浏览型号NTD85N02RT4G的Datasheet PDF文件第4页浏览型号NTD85N02RT4G的Datasheet PDF文件第5页浏览型号NTD85N02RT4G的Datasheet PDF文件第6页浏览型号NTD85N02RT4G的Datasheet PDF文件第7页 
NTD85N02R  
Power MOSFET  
85 Amps, 24 Volts  
N−Channel DPAK  
Features  
http://onsemi.com  
Pb−Free Packages are Available  
Planar HD3e Process for Fast Switching Performance  
V
DSS  
R
TYP  
I MAX  
D
DS(ON)  
Low R  
to Minimize Conduction Loss  
DS(on)  
24 V  
4.8 mW  
85 A  
Low C to Minimize Driver Loss  
iss  
Low Gate Charge  
N−Channel  
D
MAXIMUM RATINGS (T = 25°C Unless otherwise specified)  
J
Parameter  
Drain−to−Source Voltage  
Symbol Value Unit  
G
V
DSS  
24  
V
dc  
dc  
Gate−to−Source Voltage − Continuous  
V
GS  
±20  
V
S
Thermal Resistance − Junction−to−Case  
R
P
1.6  
78.1  
°C/W  
W
q
JC  
Total Power Dissipation @ T = 25°C  
C
D
4
Drain Current  
Continuous @ T = 25°C, Limited by Package  
I
I
85  
32  
96  
A
A
A
C
D
Continuous @ T = 25°C, Limited by Wires  
A
D
4
Single Pulse (t 10 ms)  
I
p
DM  
Thermal Resistance, Junction−to−Ambient  
(Note 1)  
R
52  
°C/W  
q
JA  
1
2
1
2
Total Power Dissipation @ T = 25°C  
P
I
2.4  
16  
W
A
3
3
A
D
Drain Current − Continuous @ T = 25°C  
A
D
DPAK  
DPAK−3  
CASE 369C  
STYLE2  
CASE 369D  
STYLE 2  
Thermal Resistance, Junction−to−Ambient  
(Note 2)  
R
100  
°C/W  
q
JA  
Total Power Dissipation @ T = 25°C  
P
1.25  
12  
W
A
A
D
Drain Current − Continuous @ T = 25°C  
I
D
A
MARKING DIAGRAM  
& PIN ASSIGNMENTS  
Operating and Storage Temperature Range  
Single Pulse Drain−to−Source Avalanche  
T , T  
−55 to  
150  
°C  
J
stg  
E
AS  
85  
mJ  
4
Energy − Starting T = 25°C  
J
(V = 30 V , V = 10 V , I = 13 A ,  
DD  
dc  
GS  
dc  
L
pk  
1 Gate  
1
3
L = 1 mH, R = 25 W)  
YWW  
85  
N02  
G
2 Drain  
3 Source  
4 Drain  
4
2
Maximum Lead Temperature for Soldering  
Purposes, 1/8from Case for 10 Seconds  
T
L
260  
°C  
Maximum ratings are those values beyond which device damage can occur.  
Maximum ratings applied to the device are individual stress limit values (not  
normal operating conditions) and are not valid simultaneously. If these limits  
are exceeded, device functional operation is not implied, damage may occur  
and reliability may be affected.  
Y
WW  
= Year  
= Work Week  
85N02R = Specific Device Code  
1
2
3
1. When surface mounted to an FR4 board using 1 inch pad size,  
2
(Cu Area 1.127 in ).  
ORDERING INFORMATION  
See detailed ordering and shipping information in the package  
dimensions section on page 7 of this data sheet.  
2. When surface mounted to an FR4 board using minimum recommended pad  
2
size, (Cu Area 0.412 in ).  
Semiconductor Components Industries, LLC, 2004  
1
Publication Order Number:  
September, 2004 − Rev. 6  
NTD85N02R/D  
 

NTD85N02RT4G 替代型号

型号 品牌 替代类型 描述 数据表
NTD4905NT4G ONSEMI

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NTD110N02RT4G ONSEMI

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STD95N2LH5 STMICROELECTRONICS

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SWITCHING POWER SUPPLIES