R
3055L104
60V N -Channel MOSFET
UMW
Features
•
•
•
•
•
Lower RDS(on)
Lower VDS(on)
Tighter VSD Specification
Lower Diode Reverse Recovery Time
Lower Reverse Recovery Stored Charge
Typical Applications
•
•
•
•
Power Supplies
Converters
Power Motor Controls
Bridge Circuits
D
•
•
•
VDS(V) = 60V
ID = 12A (VGS= 10V)
RDS(ON) < 104mΩ (V GS = 5V)
G
S
°
MAXIMUM RATINGS (T = 25 C unless otherwise noted)
J
Rating
Symbol
Value
60
Unit
Vdc
Vdc
Vdc
Drain−to−Source Voltage
V
DSS
Drain−to−Gate Voltage (R = 10 MW)
V
DGR
60
GS
Gate−to−Source Voltage, Continuous
V
V
"15
"20
GS
GS
− Non−Repetitive (t v10 ms)
p
Drain Current
− Continuous @ T = 25°C
I
12
10
45
Adc
Apk
A
D
− Continuous @ T = 100°C
I
D
A
− Single Pulse (t v10 ms)
I
DM
p
Total Power Dissipation @ T = 25°C
Derate above 25°C
P
D
48
0.32
2.1
W
W/°C
W
A
Total Power Dissipation @ T = 25°C (Note 1)
A
Total Power Dissipation @ T = 25°C (Note 2)
1.5
W
A
Operating and Storage Temperature Range
Single Pulse Drain−to−Source Avalanche
T , T
−55 to
+175
°C
J
stg
E
AS
61
mJ
Energy − Starting T = 25°C
J
(V = 25 Vdc, V = 5.0 Vdc, L = 1.0 mH
DD
GS
I
= 11 A, V = 60 Vdc)
DS
L(pk)
Thermal Resistance, − Junction−to−Case
− Junction−to−Ambient (Note 1)
− Junction−to−Ambient (Note 2)
R
R
R
3.13
71.4
100
°C/W
°C
q
JC
JA
JA
q
q
Maximum Lead Temperature for Soldering
T
260
L
Purposes, 1/8″ from case for 10 seconds
Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are
individual stress limit values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded,
device functional operation is not implied, damage may occur and reliability may be affected.
2
1. When surface mounted to an FR4 board using 1″ pad size, (Cu Area 1.127 in ).
2. When surface mounted to an FR4 board using the minimum recommended pad size, (Cu Area 0.412 in ).
2
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UTD Semiconductor Co.,Limited
1