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NTD3055L104T4G PDF预览

NTD3055L104T4G

更新时间: 2024-11-18 17:15:35
品牌 Logo 应用领域
友台半导体 - UMW /
页数 文件大小 规格书
7页 434K
描述
种类:N-Channel;漏源电压(Vdss):60V;持续漏极电流(Id)(在25°C时):12A;Vgs(th)(V):±20

NTD3055L104T4G 数据手册

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R
3055L104  
60V N -Channel MOSFET  
UMW  
Features  
Lower RDS(on)  
Lower VDS(on)  
Tighter VSD Specification  
Lower Diode Reverse Recovery Time  
Lower Reverse Recovery Stored Charge  
Typical Applications  
Power Supplies  
Converters  
Power Motor Controls  
Bridge Circuits  
D
VDS(V) = 60V  
ID = 12A (VGS= 10V)  
RDS(ON) < 104m(V GS = 5V)  
G
S
°
MAXIMUM RATINGS (T = 25 C unless otherwise noted)  
J
Rating  
Symbol  
Value  
60  
Unit  
Vdc  
Vdc  
Vdc  
Drain−to−Source Voltage  
V
DSS  
Drain−to−Gate Voltage (R = 10 MW)  
V
DGR  
60  
GS  
Gate−to−Source Voltage, Continuous  
V
V
"15  
"20  
GS  
GS  
− Non−Repetitive (t v10 ms)  
p
Drain Current  
− Continuous @ T = 25°C  
I
12  
10  
45  
Adc  
Apk  
A
D
− Continuous @ T = 100°C  
I
D
A
− Single Pulse (t v10 ms)  
I
DM  
p
Total Power Dissipation @ T = 25°C  
Derate above 25°C  
P
D
48  
0.32  
2.1  
W
W/°C  
W
A
Total Power Dissipation @ T = 25°C (Note 1)  
A
Total Power Dissipation @ T = 25°C (Note 2)  
1.5  
W
A
Operating and Storage Temperature Range  
Single Pulse Drain−to−Source Avalanche  
T , T  
55 to  
+175  
°C  
J
stg  
E
AS  
61  
mJ  
Energy − Starting T = 25°C  
J
(V = 25 Vdc, V = 5.0 Vdc, L = 1.0 mH  
DD  
GS  
I
= 11 A, V = 60 Vdc)  
DS  
L(pk)  
Thermal Resistance, − Junction−to−Case  
− Junction−to−Ambient (Note 1)  
− Junction−to−Ambient (Note 2)  
R
R
R
3.13  
71.4  
100  
°C/W  
°C  
q
JC  
JA  
JA  
q
q
Maximum Lead Temperature for Soldering  
T
260  
L
Purposes, 1/8from case for 10 seconds  
Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are  
individual stress limit values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded,  
device functional operation is not implied, damage may occur and reliability may be affected.  
2
1. When surface mounted to an FR4 board using 1pad size, (Cu Area 1.127 in ).  
2. When surface mounted to an FR4 board using the minimum recommended pad size, (Cu Area 0.412 in ).  
2
www.umw-ic.com  
UTD Semiconductor Co.,Limited  
1

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