Datasheet > NTD24061G

NTD24061G

更新时间： 2024-09-23 12:05:07

品牌	Logo	应用领域
安森美 - ONSEMI		/
页数	文件大小	规格书
8页	75K
描述
Power MOSFET 60 Volt, 24 Amp NâChannel DPAK

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NTD24061G 数据手册

NTD24N06

Power MOSFET

60 Volt, 24 Amp

N−Channel DPAK

Designed for low voltage, high speed switching applications in

power supplies, converters and power motor controls and bridge

circuits.

http://onsemi.com

DS(on)

TYP

I MAX

(BR)DSS

Features

60 V

32 mW

24 A

• Pb−Free Packages are Available

N−Channel

Typical Applications

• Power Supplies

• Converters

• Power Motor Controls

• Bridge Circuits

MAXIMUM RATINGS (T = 25°C unless otherwise noted)

MARKING DIAGRAMS

& PIN ASSIGNMENTS

Rating

Symbol Value

Unit

Vdc

Drain−to−Source Voltage

DSS

Drain−to−Gate Voltage (R = 10 MW)

Drain

DGR

Gate−to−Source Voltage

− Continuous

"20

"30

− Non−repetitive (t v10 ms)

Drain Current

− Continuous @ T = 25°C, T = 150°C

DPAK

CASE 369C

(Surface Mount)

STYLE 2

Adc

Apk

− Continuous @ T = 25°C, T = 175°C

Gate

Drain

− Continuous @ T = 100°C, T = 175°C

Source

− Single Pulse (t v10 ms), T = 175°C

Total Power Dissipation @ T = 25°C

62.5

0.42

1.88

1.36

W/°C

Drain

Derate above 25°C

Total Power Dissipation @ T = 25°C (Note 1)

Total Power Dissipation @ T = 25°C (Note 2)

Operating and Storage Temperature Range

T , T

−55 to

+175

°C

stg

Single Pulse Drain−to−Source Avalanche

162

DPAK

CASE 369D

(Straight Lead)

STYLE 2

Energy − Starting T = 25°C

(V = 50 Vdc, V = 10 Vdc,

L = 1.0 mH, I (pk) = 18 A, V = 60 Vdc)

Gate Drain Source

Thermal Resistance

°C/W

°C

− Junction−to−Case

− Junction−to−Ambient (Note 1)

− Junction−to−Ambient (Note 2)

2.4

110

= Year

24N06

= Work Week

= Device Code

= Pb−Free Package

Maximum Lead Temperature for Soldering

Purposes, 1/8 in from case for 10 seconds

260

Maximum ratings are those values beyond which device damage can occur.

Maximum ratings applied to the device are individual stress limit values (not

normal operating conditions) and are not valid simultaneously. If these limits are

exceeded, device functional operation is not implied, damage may occur and

reliability may be affected.

ORDERING INFORMATION

See detailed ordering and shipping information in the package

dimensions section on page 2 of this data sheet.

1. When surface mounted to an FR−4 board using the 0.5 sq in drain pad size.

2. When surface mounted to an FR−4 board using the minimum recommended

pad size.

Semiconductor Components Industries, LLC, 2005

Publication Order Number:

August, 2005 − Rev. 4

NTD24N06/D

12 3 4 5 6 7 8

中文翻译

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