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NTD20N03L27/D

更新时间： 2024-09-22 23:54:43
品牌 Logo 应用领域
其他 - ETC /
页数 文件大小 规格书
8页 55K
描述
Power MOSFET 20 Amps， 30 Volts

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NTD20N03L27/D 数据手册

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NTD20N03L27  
Power MOSFET  
20 Amps, 30 Volts  
N–Channel DPAK  
This logic level vertical power MOSFET is a general purpose part  
that provides the “best of design” available today in a low cost power  
package. Avalanche energy issues make this part an ideal design in.  
The drain–to–source diode has a ideal fast but soft recovery.  
http://onsemi.com  
Features  
20 AMPERES  
30 VOLTS  
• Ultra–Low R  
• SPICE parameters available  
• Diode is characterized for use in bridge circuits  
, single base, advanced technology  
DS(on)  
R
= 27 mΩ  
DS(on)  
• I  
and V specified at elevated temperatures  
DSS  
DS(on)  
N–Channel  
• High Avalanche Energy Specified  
• ESD JEDAC rated HBM Class 1, MM Class A, CDM Class 0  
Typical Applications  
D
• Power Supplies  
• Inductive Loads  
G
• PWM Motor Controls  
• Replaces MTD20N03L in many applications  
S
MARKING  
DIAGRAM  
MAXIMUM RATINGS (T = 25°C unless otherwise noted)  
C
Rating  
Symbol  
Value  
Unit  
Drain–to–Source Voltage  
Drain–to–Gate Voltage (R  
V
V
30  
30  
Vdc  
Vdc  
Vdc  
DSS  
4
CASE 369A  
DPAK  
STYLE 2  
= 1.0 MΩ)  
YWW  
20N3L  
GS  
DGR  
Gate–to–Source Voltage  
– Continuous  
2
3
1
V
V
"20  
"24  
GS  
GS  
– Non–Repetitive (t v10 ms)  
p
20N3L  
Y
WW  
= Device Code  
= Year  
= Work Week  
Drain Current  
– Continuous @ T = 25_C  
I
I
20  
16  
60  
Adc  
Apk  
A
A
D
D
– Continuous @ T = 100_C  
– Single Pulse (t v10 µs)  
p
I
DM  
P
PIN ASSIGNMENT  
Total Power Dissipation @ T = 25_C  
74  
0.6  
1.75  
Watts  
W/°C  
W
A
D
Derate above 25°C  
4
Total Power Dissipation @ T = 25°C  
(Note 1.)  
C
Drain  
Operating and Storage Temperature  
Range  
T , T  
J stg  
–55 to  
150  
°C  
Single Pulse Drain–to–Source Avalanche  
E
AS  
288  
mJ  
Energy – Starting T = 25°C  
J
(V  
= 30 Vdc, V  
= 5 Vdc, L =  
DD  
GS  
= 24 A, V  
1
2
3
1.0 mH, I  
= 34 Vdc)  
L(pk)  
DS  
Gate Drain Source  
Thermal Resistance  
– Junction–to–Case  
– Junction–to–Ambient  
°C/W  
R
R
R
1.67  
100  
71.4  
θJC  
θJA  
θJA  
ORDERING INFORMATION  
– Junction–to–Ambient (Note 1.)  
Device  
Package  
DPAK  
Shipping  
75 Units/Rail  
Maximum Lead Temperature for Soldering  
Purposes, 1/8″ from case for 10 seconds  
T
260  
°C  
L
NTD20N03L27  
1. When surface mounted to an FR4 board using the minimum recommended  
pad size and repetitive rating; pulse width limited by maximum junction  
temperature.  
NTD20N03L27–1  
NTD20N03L27T4  
DPAK  
75 Units/Rail  
DPAK  
2500 Tape & Reel  
Semiconductor Components Industries, LLC, 2001  
1
Publication Order Number:  
January, 2001 – Rev. 0  
NTD20N03L27/D  
12345678

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