NTD20N03L27
Power MOSFET
20 Amps, 30 Volts, N−Channel DPAK
This logic level vertical power MOSFET is a general purpose part
that provides the “best of design” available today in a low cost power
package. Avalanche energy issues make this part an ideal design in.
The drain−to−source diode has a ideal fast but soft recovery.
http://onsemi.com
Features
20 A, 30 V, RDS(on) = 27 mW
• Pb−Free Packages are Available
N−Channel
• Ultra−Low R , Single Base, Advanced Technology
DS(on)
• SPICE Parameters Available
D
• Diode is Characterized for use in Bridge Circuits
• I
and V
Specified at Elevated Temperatures
DSS
DS(on)
• High Avalanche Energy Specified
• ESD JEDAC rated HBM Class 1, MM Class A, CDM Class 0
G
Typical Applications
S
• Power Supplies
• Inductive Loads
• PWM Motor Controls
MARKING
DIAGRAMS
• Replaces MTD20N03L in many Applications
4
Drain
MAXIMUM RATINGS (T = 25°C unless otherwise noted)
C
4
DPAK
Rating
Symbol
Value
Unit
CASE 369C
STYLE 2
Drain−to−Source Voltage
V
30
30
Vdc
Vdc
Vdc
DSS
2
1
Drain−to−Gate Voltage (R = 1.0 MW)
V
DGR
GS
3
Gate−to−Source Voltage
− Continuous
2
1
Gate
3
V
V
"20
"24
GS
GS
Drain
− Non−Repetitive (t v10 ms)
Source
p
Drain Current
4
− Continuous @ T = 25_C
I
I
20
16
60
Adc
Apk
A
D
D
Drain
− Continuous @ T = 100_C
A
− Single Pulse (t v10 ms)
p
4
I
DM
DPAK−3
CASE 369D
STYLE 2
Total Power Dissipation @ T = 25_C
P
74
0.6
1.75
W
W/°C
W
A
D
Derate above 25°C
Total Power Dissipation @ T = 25°C (Note 1)
C
Operating and Storage Temperature Range
T , T
−55 to
150
°C
J
stg
1
2
3
Single Pulse Drain−to−Source Avalanche
E
AS
288
mJ
1
2
3
Energy − Starting T = 25°C
J
Gate Drain Source
(V = 30 Vdc, V = 5 Vdc, L = 1.0 mH,
DD
GS
I
= 24 A, V = 34 Vdc)
L(pk)
DS
20N3L
A
Y
= Device Code
= Assembly Location
= Year
Thermal Resistance
− Junction−to−Case
°C/W
R
R
R
1.67
100
71.4
q
JC
JA
JA
− Junction−to−Ambient
− Junction−to−Ambient (Note 1)
q
q
WW
= Work Week
Maximum Lead Temperature for Soldering
Purposes, 1/8″ from case for 10 seconds
T
260
°C
L
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 2 of this data sheet.
Maximum ratings are those values beyond which device damage can occur.
Maximum ratings applied to the device are individual stress limit values (not
normal operating conditions) and are not valid simultaneously. If these limits
are exceeded, device functional operation is not implied, damage may occur
and reliability may be affected.
1. When surface mounted to an FR4 board using the minimum recommended
pad size and repetitive rating; pulse width limited by maximum junction
temperature.
Semiconductor Components Industries, LLC, 2004
1
Publication Order Number:
August, 2004 − Rev. 2
NTD20N03L27/D