Datasheet > 晶体管 > 小信号双极晶体管> NSVBSP19AT1G

NSVBSP19AT1G

更新时间： 2024-11-30 11:01:35

品牌	Logo	应用领域
安森美 - ONSEMI		小信号双极晶体管
页数	文件大小	规格书
4页	177K
描述
NPN 双极晶体管

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NSVBSP19AT1G 技术参数

是否无铅：	不含铅	生命周期：	Obsolete
包装说明：	,	针数：	4
Reach Compliance Code：	compliant	ECCN代码：	EAR99
风险等级：	5.82	JESD-609代码：	e3
湿度敏感等级：	1	端子面层：	Tin (Sn)

NSVBSP19AT1G 数据手册

BSP19AT1G

NPN Silicon Expitaxial

Transistor

This family of NPN Silicon Epitaxial transistors is designed for use

as a general purpose amplifier and in switching applications. The

device is housed in the SOT-223 package which is designed for

medium power surface mount applications.

http://onsemi.com

Features

SOT--223 PACKAGE

NPN SILICON HIGH VOLTAGE

TRANSISTOR SURFACE MOUNT

 High Voltage: V_(BR)CEOof 250 and 350 V

 The SOT-223 Package Can Be Soldered Using Wave or Reflow

 SOT-223 Package Ensures Level Mounting, Resulting in Improved

Thermal Conduction, and Allows Visual Inspection of Soldered Joints

 The Formed Leads Absorb Thermal Stress During Soldering,

Eliminating the Possibility of Damage to the Die

 PNP Complement is BSP16T1

COLLECTOR 2,4

BASE

 Moisture Sensitivity Level (MSL): 1

 ESD: Human Body Model (HBM) = 4 KV

Machine Model (MM) = 400 V

EMITTER 3

 These Devices are Pb--Free, Halogen Free/BFR Free and are RoHS

Compliant

MARKING

DIAGRAM

MAXIMUM RATINGS (T = 25C unless otherwise noted)

Collector

Rating

Symbol

Value

350

400

5.0

Unit

Vdc

Collector-Emitter Voltage (Open Base)

Collector-Base Voltage (Open Emitter)

Emitter-Base Voltage (Open Collector)

Collector Current (DC)

CEO

CBO

EBO

CASE 318E

TO-261AA

STYLE 1

AYW

SP19A G

Vdc

100

mAdc

Base

Emitter

Collector

THERMAL CHARACTERISTICS

Characteristic

Symbol

Max

Unit

= Assembly Location

= Year

Total Power Dissipation @ T = 25C

0.8

= Work Week

(Note 1)

Derate above 25C

SP19A = Specific Device Code

= Pb--Free Package

(Note: Microdot may be in either location)

6.4

156

mW/C

C/W

C

Thermal Resistance, Junction--to--Ambient

Junction and Storage Temperature Range

stg

--65 to +150

ORDERING INFORMATION

Stresses exceeding Maximum Ratings may damage the device. Maximum

Ratings are stress ratings only. Functional operation above the Recommended

Operating Conditions is not implied. Extended exposure to stresses above the

Recommended Operating Conditions may affect device reliability.

1. Device mounted on a FR-4 glass epoxy printed circuit board using minimum

recommended footprint.

†

Device

Package

Shipping

BSP19AT1G

SOT--223

(Pb--Free)

1000 / Tape & Reel

†For information on tape and reel specifications,

including part orientation and tape sizes, please

refer to our Tape and Reel Packaging Specifications

Brochure, BRD8011/D.



Semiconductor Components Industries, LLC, 2010

Publication Order Number:

September, 2010 -- Rev. 8

BSP19AT1/D

12 3 4

中文翻译

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