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NSVBC858BLT1G PDF预览

NSVBC858BLT1G

更新时间: 2024-11-29 11:01:35
品牌 Logo 应用领域
安森美 - ONSEMI 光电二极管晶体管
页数 文件大小 规格书
7页 154K
描述
PNP Bipolar Transistor

NSVBC858BLT1G 技术参数

是否无铅: 不含铅生命周期:Active
包装说明:SMALL OUTLINE, R-PDSO-G3针数:3
Reach Compliance Code:compliantECCN代码:EAR99
风险等级:1.5最大集电极电流 (IC):0.1 A
集电极-发射极最大电压:30 V配置:SINGLE
最小直流电流增益 (hFE):220JEDEC-95代码:TO-236AB
JESD-30 代码:R-PDSO-G3JESD-609代码:e3
湿度敏感等级:1元件数量:1
端子数量:3最高工作温度:150 °C
最低工作温度:-55 °C封装主体材料:PLASTIC/EPOXY
封装形状:RECTANGULAR封装形式:SMALL OUTLINE
峰值回流温度(摄氏度):NOT SPECIFIED极性/信道类型:PNP
最大功率耗散 (Abs):0.3 W参考标准:AEC-Q101
子类别:Other Transistors表面贴装:YES
端子面层:Tin (Sn)端子形式:GULL WING
端子位置:DUAL处于峰值回流温度下的最长时间:NOT SPECIFIED
晶体管元件材料:SILICON标称过渡频率 (fT):100 MHz
Base Number Matches:1

NSVBC858BLT1G 数据手册

 浏览型号NSVBC858BLT1G的Datasheet PDF文件第2页浏览型号NSVBC858BLT1G的Datasheet PDF文件第3页浏览型号NSVBC858BLT1G的Datasheet PDF文件第4页浏览型号NSVBC858BLT1G的Datasheet PDF文件第5页浏览型号NSVBC858BLT1G的Datasheet PDF文件第6页浏览型号NSVBC858BLT1G的Datasheet PDF文件第7页 
BC856ALT1G Series  
General Purpose  
Transistors  
PNP Silicon  
Features  
www.onsemi.com  
S and NSV Prefix for Automotive and Other Applications Requiring  
Unique Site and Control Change Requirements; AEC−Q101  
Qualified and PPAP Capable  
COLLECTOR  
3
These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS  
Compliant  
1
BASE  
MAXIMUM RATINGS (T = 25°C unless otherwise noted)  
A
2
Rating  
Symbol  
Value  
Unit  
EMITTER  
Collector-Emitter Voltage  
V
V
V
V
CEO  
CBO  
EBO  
BC856, SBC856  
BC857, SBC857  
BC858, NSVBC858, BC859  
−65  
−45  
−30  
3
Collector-Base Voltage  
V
1
BC856, SBC856  
BC857, SBC857  
BC858, NSVBC858, BC859  
−80  
−50  
−30  
2
SOT−23 (TO−236)  
CASE 318  
Emitter−Base Voltage  
−5.0  
−100  
−200  
V
STYLE 6  
Collector Current − Continuous  
Collector Current − Peak  
I
C
I
C
mAdc  
mAdc  
THERMAL CHARACTERISTICS  
Characteristic  
MARKING DIAGRAM  
Symbol  
Max  
Unit  
Total Device Dissipation FR5 Board,  
P
D
xx M G  
(Note 1) T = 25°C  
225  
1.8  
mW  
mW/°C  
A
G
Derate above 25°C  
1
Thermal Resistance,  
Junction−to−Ambient  
R
556  
°C/W  
q
JA  
xx = Device Code  
xx = (Refer to page 6)  
Total Device Dissipation Alumina  
P
D
Substrate, (Note 2) T = 25°C  
300  
2.4  
mW  
mW/°C  
A
M
= Date Code*  
Derate above 25°C  
G
= Pb−Free Package  
(Note: Microdot may be in either location)  
Thermal Resistance,  
Junction−to−Ambient  
R
417  
°C/W  
q
JA  
*Date Code orientation and/or overbar may  
vary depending upon manufacturing location.  
Junction and Storage Temperature  
T , T  
J
55 to +150  
°C  
stg  
Stresses exceeding those listed in the Maximum Ratings table may damage the  
device. If any of these limits are exceeded, device functionality should not be  
assumed, damage may occur and reliability may be affected.  
1. FR−5 = 1.0 x 0.75 x 0.062 in.  
ORDERING INFORMATION  
See detailed ordering and shipping information in the package  
dimensions section on page 6 of this data sheet.  
2. Alumina = 0.4 x 0.3 x 0.024 in 99.5% alumina.  
© Semiconductor Components Industries, LLC, 1994  
1
Publication Order Number:  
October, 2016 − Rev. 15  
BC856ALT1/D  
 

NSVBC858BLT1G 替代型号

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BC859BLT3G ONSEMI

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BC859BLT1G ONSEMI

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General Purpose Transistors PNP Silicon
BC858BLT1G ONSEMI

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