Datasheet > NSSM103M3T1NHT001

NSSM103M3T1NHT001

更新时间： 2023-12-06 20:12:59

品牌	Logo	应用领域
力特 - LITTELFUSE		/
页数	文件大小	规格书
3页	287K
描述
NSSM103M3T1NHT001是一款NSS系列表面安装式微型MELF型玻璃封装热敏电阻，具有以下规格: 25°C下的电阻 = 10,000（规定温度下的标称电阻） 0°C至100°C的精确度

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NSSM103M3T1NHT001 数据手册

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Surface Mount Thermistors

NSS Series

MELF-Style, Glass-Encapsulated

REACH

Description

The NSS series surface-mount, MELF-style, glass-encapsulated thermistors are manufactured using exceptionally stable

NTC chips that are hermetically sealed in a glass package. MELF stands for Metal Electrode Leadless Face, which is a

reference to a type of leadless cylindrical electronic surface mount device that is metallized at its ends. The NSS series

consists of two terminals bonded into a cylindrical body. The result is an extremely reliable surface-mount package that can

withstand the most severe environmental conditions. These thermistors exhibit excellent long-term reliability and stability

and are well-suited for applications where their interchangeability eliminates the necessity for costly individual circuit

calibration. Their uniform dimensions make them especially useful with automatic insertion equipment. These thermistors

are very cost-effective and are available with options such as non-standard resistance values and tolerances, tape and reel

packaging, and point-matching at specified temperatures for consistent performance.

Features

• Moisture proof

• Miniature/practical design

• Higher density for connections

• Excellent long-term stability

• High temperature capability to +220 °C

• Surface-mountable

• Low cost

Beneﬁts

• High reliability

• Fast response time

• Efficient

• Cost-effective

• Superior mechanical performance

• Automated simplified production

• Consistent performance

Applications

• Consumer technology

• Household electronics

• Heating and air-conditioning

• Industrial electronics and automation

• High temperature printer ink sensing

• Printed circuit board temperature sensing

Littelfuse.com/NSS

Speciﬁcations are subject to change without notice.

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Revised: 06/14/2023

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