Datasheet > NSP1833

NSP1833

更新时间： 2024-11-23 17:01:15

品牌	Logo	应用领域
纳芯微 - NOVOSENSE		传感器
页数	文件大小	规格书
8页	301K
描述
纳芯微NSP1833系列MEMS微差压传感器芯片主要利用硅的压阻效应，并结合自主研发的MEMS 微加工工艺设计而成，该系传感器晶圆的制造工艺平台经过IATF16949认证，且每片晶圆都经过正/背面

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NSP1833 数据手册

NSP1833 Series

MEMS Ultra-Low Differential Pressure Sensor Die

Datasheet (EN) 1.0

Product Overview

Applications

Novosense NSP1833 Series MEMS pressure sensos are

high-performance and high-reliability MEMS ultra-low

differential pressure sensor dies, based on the principle of

mono-crystalline silicon high sensitivity piezoresistive

effect, and manufactured by the advanced MEMS

technology. The NSP1833 series MEMS ultra-low

differential pressure sensors are guaranteed the accuracy

and stability better than 1% FS in overall lifetime, the

typical pressure range is 0~±1000Pa, widely used in

consumer electronics, medical electronics, industrial

controls etc.



White household

Consumer

Medical

Industrial Controls

Device Information

Part Number

Span

0~±1000Pa

Die Size

2.5mmx2.5mmx0.4mm

NSP1833-Axx01k

The wafer manufactured platform of NSP1833 series

MEMS low differential pressure sensor is verified to fulfill

the International Automotive Standard IATF16949:2016.

Each wafer is inspected both in backside and frontside by

100% AOI and the electronic AOI wafer map is provided for

each wafer. For additional shipping options, please contact

Novosense sales.

Key Features



Pressure range: 0~±1000Pa

Operating temperature：-40~85℃

Die size：2.5x2.5x0.4mm

Accuracy and stability better than 1%FS

ROHS & REACH compliant

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