Datasheet > NSP1832

NSP1832

更新时间： 2024-11-23 17:01:39

品牌	Logo	应用领域
纳芯微 - NOVOSENSE		传感器
页数	文件大小	规格书
8页	296K
描述
纳芯微NSP1832系列MEMS差压传感器芯片主要利用硅的压阻效应，并结合自主研发的MEMS 微加工工艺设计而成，该系传感器晶圆的制造工艺平台经过IATF16949认证，且每片晶圆都经过正/背面

阅读下载

中文翻译

获取价格

数据手册

如果您发现信息不准确，欢迎纠错

NSP1832 数据手册

NSP1832 Series

MEMS Differential Pressure Sensor Die

Datasheet (EN) 1.0

⚫

Corrosion-resistant Pt metal bond pad structure

Enhanced reliability with the double bond pad design

IATF16949 certificated manufactured platform

AEC-Q103 automotive standards qualified

ROHS & REACH compliant

Product Overview

Novosense NSP1832 series MEMS pressure sensors are

high-performance and high-reliability MEMS differential

pressure sensor dies, based on the principle of mono-

crystalline silicon high sensitivity piezoresistive effect, and

manufactured by the advanced MEMS technology. The

NSP1832 series MEMS differential pressure sensors are

qualified according to AEC-Q103 and guaranteed the

accuracy and stability better than 1% FS in overall lifetime,

the typical pressure ranges are 0~±5kPa, 0~±35kPa and

0~ ± 100kPa, widely used in automotive electronics,

industrial controls, etc. The corrosion-resistant Pt metal

bond pads make NSP1832 series pressure sensors to be

suitable for harsh environment applications such as DPF,

GPF, EVAP etc. especially.

Applications

⚫

Gasoline Particulate Filter

Diesel Particulate Filter

EVAP Evaporative System

Industrial Controls

Device Information

Part Number

Span

Bond Pad Metal

NSP1832-Axx005

Pt Metal

0~±5kPa

NSP1832-Axx035

NSP1832-Axx100

Pt Metal

0~±35kPa

0~±100kPa

The wafer manufactured platform of NSP1832 series

MEMS differential pressure sensors is verified to fulfill the

International Automotive Standard IATF16949:2016. Each

wafer is inspected both in backside and frontside by 100%

AOI and the electronic AOI wafer map is provided for each

wafer. For additional shipping options, please contact

Novosense sales.

Key Features

⚫

Pressure range：0~±5kPa, ±35kPa, ±100kPa

Operating temperature：-40~150℃

Die size：1.65mmx1.65mmx0.4mm

Accuracy and Stability better than 1%FS

Page 1

12 3 4 5 6 7 8

中文翻译

下载PDF

与NSP1832相关器件

型号	品牌	获取价格	描述	数据表
NSP1833	NOVOSENSE	获取价格	纳芯微NSP1833系列MEMS微差压传感器芯片主要利用硅的压阻效应，并结合自主研发的ME
NSP200JB-0R13	YAGEO	获取价格	Fixed Resistor, Wire Wound, 2W, 0.13ohm, 250V, 5% +/-Tol, 7128
NSP200JB-0R15	YAGEO	获取价格	Fixed Resistor, Wire Wound, 2W, 0.15ohm, 250V, 5% +/-Tol, 7128
NSP200JB-0R18	YAGEO	获取价格	Fixed Resistor, Wire Wound, 2W, 0.18ohm, 250V, 5% +/-Tol, 7128
NSP200JB-0R22	YAGEO	获取价格	RES, AXIAL, WIREWOUND, 0.22ohm, 250WV, 5% +/-TOL, 7128 CASE
NSP200JB-0R24	YAGEO	获取价格	RES, AXIAL, WIREWOUND, 0.24ohm, 250WV, 5% +/-TOL, 7128 CASE
NSP200JB-0R27	YAGEO	获取价格	水泥电阻
NSP200JB-0R39	YAGEO	获取价格	RES, AXIAL, WIREWOUND, 0.39ohm, 250WV, 5% +/-TOL, 7128 CASE
NSP200JB-0R43	YAGEO	获取价格	Fixed Resistor, Wire Wound, 2W, 0.43ohm, 250V, 5% +/-Tol, 7128
NSP200JB-0R68	YAGEO	获取价格	Fixed Resistor, Wire Wound, 2W, 0.68ohm, 250V, 5% +/-Tol, 7128

与NSP1832相关文章

解析光耦仿真器：升级光耦合器技术的必要性
2024-11-18

34
英伟达新一代Blackwell GPU过热问题致交付延迟
2024-11-18

26
国产厂商思特威CMOS图像传感器芯片单月出货超1亿颗，技术创新引领行业发展
2024-11-14

54
台积电5nm和3nm产能利用率达100%，半导体行业景气度持续攀升
2024-11-14

52

产品中心

服务支持

精选活动

关于我们

帮助中心

NSP1832

NSP1832 数据手册

与NSP1832相关器件

与NSP1832相关文章

您还可以找

产品中心

服务支持

精选活动

关于我们

帮助中心

NSP1832

NSP1832 数据手册

与NSP1832相关器件

与NSP1832相关文章

您还可以找

您在本页遇到什么问题？