Datasheet > NSP1831

NSP1831

更新时间： 2024-04-09 19:00:11

品牌	Logo	应用领域
纳芯微 - NOVOSENSE		传感器
页数	文件大小	规格书
8页	306K
描述
纳芯微NSP1831系列MEMS低差压传感器芯片主要利用硅的压阻效应，并结合自主研发的MEMS 微加工工艺设计而成，该系传感器晶圆的制造工艺平台经过IATF16949认证，且每片晶圆都经过正/背面

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NSP1831 数据手册

NSP1831 Series

MEMS Low Differential Pressure Sensor Die

Datasheet (EN) 1.0



ROHS & REACH compliant

Product Overview

Applications

Novosense NSP1831 Series MEMS pressure sensos are

high-performance and high-reliability MEMS Low

differential pressure sensor dies, based on the principle of

mono-crystalline silicon high sensitivity piezoresistive

effect, and manufactured by the advanced MEMS

technology. The NSP1831 series MEMS Low differential

pressure sensors are qualified according to AEC-Q103 and

guaranteed the accuracy and stability better than 1% FS in

overall lifetime, the typical pressure ranges are 0~±6kPa

and 0~±10kPa, widely used in consumer electronics,

medical electronics, industrial controls, automotive

electronics etc.



White household

Consumer

Medical

Industrial Controls

Device Information

Part Number

Span

0~±6kPa

Die Size

2.0mmx2.0mmx0.4mm

NSP1831-Bxx006

NSP1831-Axx010

2.0mmx2.0mmx0.4mm

0~±10kPa

The wafer manufactured platform of NSP1831 series

MEMS low differential pressure sensor is verified to fulfill

the International Automotive Standard IATF16949:2016.

Each wafer is inspected both in backside and frontside by

100% AOI and the electronic AOI wafer map is provided for

each wafer. For additional shipping options, please contact

Novosense sales.

Key Features



Pressure range: 0~±6kPa, ±10kPa

Operating temperature：-40~125℃

Die size：2.0mmx2.0mmx0.4mm

Accuracy and stability better than 1%FS

IATF16949 certificated manufactured platform

AEC-Q103 automotive standards qualified

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型号	品牌	描述	获取价格	数据表
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NSP1833	NOVOSENSE	纳芯微NSP1833系列MEMS微差压传感器芯片主要利用硅的压阻效应，并结合自主研发的ME	获取价格
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