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NSL12AWT1G PDF预览

NSL12AWT1G

更新时间: 2024-11-07 10:32:07
品牌 Logo 应用领域
安森美 - ONSEMI 晶体小信号双极晶体管开关光电二极管
页数 文件大小 规格书
4页 122K
描述
High Current Surface Mount PNP Silicon Low VCE(sat) Transistor

NSL12AWT1G 技术参数

是否无铅: 不含铅生命周期:Active
零件包装代码:SC-70包装说明:SMALL OUTLINE, R-PDSO-G6
针数:6Reach Compliance Code:compliant
ECCN代码:EAR99风险等级:0.9
Is Samacsys:N最大集电极电流 (IC):2 A
集电极-发射极最大电压:12 V配置:SINGLE
最小直流电流增益 (hFE):100JESD-30 代码:R-PDSO-G6
JESD-609代码:e3湿度敏感等级:1
元件数量:1端子数量:6
最高工作温度:150 °C封装主体材料:PLASTIC/EPOXY
封装形状:RECTANGULAR封装形式:SMALL OUTLINE
峰值回流温度(摄氏度):260极性/信道类型:PNP
最大功率耗散 (Abs):0.65 W认证状态:Not Qualified
子类别:Other Transistors表面贴装:YES
端子面层:Tin (Sn)端子形式:GULL WING
端子位置:DUAL处于峰值回流温度下的最长时间:40
晶体管应用:SWITCHING晶体管元件材料:SILICON
标称过渡频率 (fT):100 MHzBase Number Matches:1

NSL12AWT1G 数据手册

 浏览型号NSL12AWT1G的Datasheet PDF文件第2页浏览型号NSL12AWT1G的Datasheet PDF文件第3页浏览型号NSL12AWT1G的Datasheet PDF文件第4页 
NSL12AWT1G  
High Current Surface Mount  
PNP Silicon Low VCE(sat)  
Transistor for Battery  
Operated Applications  
Features  
http://onsemi.com  
High Current Capability (3 A)  
High Power Handling (Up to 650 mW)  
12 VOLTS  
3.0 AMPS  
PNP TRANSISTOR  
Low V  
(170 mV Typical @ 1 A)  
CE(s)  
Small Size  
These Devices are PbFree, Halogen Free/BFR Free and are RoHS  
Compliant  
COLLECTOR  
1, 2, 5, 6  
Benefits  
High Specific Current and Power Capability Reduces Required PCB Area  
Reduced Parasitic Losses Increases Battery Life  
3
BASE  
MAXIMUM RATINGS (T = 25°C)  
A
Rating  
Symbol  
Max  
12  
12  
5.0  
Unit  
Vdc  
Vdc  
Vdc  
Adc  
4
EMITTER  
Collector-Emitter Voltage  
Collector-Base Voltage  
Emitter-Base Voltage  
V
CEO  
V
CBO  
V
EBO  
Collector Current Continuous  
Collector Current Peak  
I
C
2.0  
3.0  
I
CM  
SC88/SOT363  
CASE 419B  
STYLE 20  
Electrostatic Discharge  
ESD  
HBM Class 3  
MM Class C  
1
Stresses exceeding Maximum Ratings may damage the device. Maximum  
Ratings are stress ratings only. Functional operation above the Recommended  
Operating Conditions is not implied. Extended exposure to stresses above the  
Recommended Operating Conditions may affect device reliability.  
THERMAL CHARACTERISTICS  
MARKING DIAGRAM  
Characteristic  
Symbol  
Max  
Unit  
Total Device Dissipation  
P
(Note 1)  
450  
mW  
D
6
T = 25°C  
A
Derate above 25°C  
3.6  
mW/°C  
°C/W  
11 MG  
Thermal Resistance,  
R
(Note 1)  
275  
q
JA  
G
JunctiontoAmbient  
1
Total Device Dissipation  
P
(Note 2)  
(Note 2)  
650  
mW  
D
T = 25°C  
A
M
G
= Date Code  
= PbFree Package  
Derate above 25°C  
5.2  
mW/°C  
°C/W  
Thermal Resistance,  
JunctiontoAmbient  
R
192  
q
(Note: Microdot may be in either location)  
JA  
Thermal Resistance,  
JunctiontoLead 6  
R
105  
1.4  
°C/W  
W
q
JL  
ORDERING INFORMATION  
See detailed ordering and shipping information in the package  
dimensions section on page 2 of this data sheet.  
Total Device Dissipation  
(Single Pulse < 10 sec.)  
P Single  
D
Junction and Storage  
Temperature Range  
T , T  
55 to +150  
°C  
J
stg  
1. FR4, Minimum Pad, 1 oz Coverage  
2. FR4, 1Pad, 1 oz Coverage  
© Semiconductor Components Industries, LLC, 2009  
1
Publication Order Number:  
October, 2009 Rev. 3  
NSL12AW/D  
 

NSL12AWT1G 替代型号

型号 品牌 替代类型 描述 数据表
NSS12200WT1G ONSEMI

类似代替

12 V, 3 A, Low VCE(sat) PNP Transistor
NSL12AWT1 ONSEMI

类似代替

High Current Surface Mount PNP Silicon Low VCE(sat) Transistor for Battery Operated Applic

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