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DP83261AVF

更新时间： 2024-02-14 12:23:56

品牌	Logo	应用领域
美国国家半导体 - NSC		外围集成电路数据传输控制器时钟
页数	文件大小	规格书
132页	1112K
描述
BMAC Device (FDDI Media Access Controller)

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技术参数
数据手册

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DP83261AVF 技术参数

是否Rohs认证：	不符合	生命周期：	Obsolete
包装说明：	BQFP, SPQFP132,1.1SQ	Reach Compliance Code：	unknown
风险等级：	5.92	Is Samacsys：	N
JESD-30 代码：	S-PQFP-G132	JESD-609代码：	e0
端子数量：	132	最高工作温度：	70 °C
最低工作温度：		封装主体材料：	PLASTIC/EPOXY
封装代码：	BQFP	封装等效代码：	SPQFP132,1.1SQ
封装形状：	SQUARE	封装形式：	FLATPACK
电源：	5 V	认证状态：	Not Qualified
子类别：	Other uPs/uCs/Peripheral ICs	标称供电电压：	5 V
表面贴装：	YES	技术：	CMOS
温度等级：	COMMERCIAL	端子面层：	Tin/Lead (Sn/Pb)
端子形式：	GULL WING	端子节距：	0.635 mm
端子位置：	QUAD	Base Number Matches：	1

DP83261AVF 数据手册

October 1994

DP83261 BMAC^TMDevice

(FDDI Media Access Controller)

General Description

The DP83261 BMAC device implements the Media Access

Features

Full duplex operation with through parity

Control (MAC) protocol for operation in an FDDI token ring.

The BMAC device provides a flexible interface to the

BSI-2^TMdevice. The BMAC device offers the capabilities

described in the ANSI X3T9.5 MAC Standard and several

functional enhancements allowed by the Standard.

Supports all FDDI ring scheduling classes (asynchro-

nous, synchronous, restricted asynchronous, and

immediate)

Supports individual, group, short, long and external

addressing

The BMAC device transmits, receives, repeats, and strips

tokens and frames. It uses a full duplex architecture that

allows diagnostic transmission and self testing for error iso-

lation. The duplex architecture also allows full duplex data

service on point-to-point connections. Management soft-

ware is also aided by an array of on chip statistical counters,

and the ability to internally generate Claim and Beacon

frames without program intervention. A multi-frame stream-

ing interface is provided to the system interface device.

Generates Beacon, Claim and Void frames without

intervention

Provides extensive ring and station statistics

Provides extensions for MAC level bridging

Provides separate management interface

Uses low power microCMOS

TL/F/10387–1

FIGURE 1-1. FDDI Chip Set Block Diagram

TRI-STATEÉis a registered trademark of National Semiconductor Corporation.

BSI-2^TM, BMAC^TM, PLAYER ^TM, CDD^TMand CRD^TMare trademarks of National Semiconductor Corporation.

1995 National Semiconductor Corporation

TL/F/10387

RRD-B30M105/Printed in U. S. A.

12 3 4 5 6 7...132

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