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NSBA144EF3T5G

更新时间: 2024-11-28 06:00:43
品牌 Logo 应用领域
安森美 - ONSEMI 晶体数字晶体管
页数 文件大小 规格书
6页 113K
描述
Digital Transistors (BRT)

NSBA144EF3T5G 数据手册

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NSBA114EF3T5G Series  
Preferred Devices  
Digital Transistors (BRT)  
PNP Silicon Surface Mount Transistors  
with Monolithic Bias Resistor Network  
This new series of digital transistors is designed to replace a single  
device and its external resistor bias network. The digital transistor  
contains a single transistor with a monolithic bias network consisting  
of two resistors; a series base resistor and a baseemitter resistor. The  
digital transistor eliminates these individual components by  
integrating them into a single device. The use of a digital transistor can  
reduce both system cost and board space. The device is housed in the  
SOT1123 package which is designed for low power surface mount  
applications.  
http://onsemi.com  
PNP SILICON DIGITAL  
TRANSISTORS  
PIN 3  
COLLECTOR  
(OUTPUT)  
Features  
PIN 1  
BASE  
(INPUT)  
R1  
R2  
Simplifies Circuit Design  
Reduces Board Space  
Reduces Component Count  
PIN 2  
EMITTER  
(GROUND)  
The SOT1123 Package can be Soldered using Wave or Reflow.  
Available in 4 mm, 8000 Unit Tape & Reel  
These are PbFree Devices  
These are HalideFree Devices  
3
2
MAXIMUM RATINGS (T = 25°C unless otherwise noted)  
A
1
Rating  
Collector-Base Voltage  
Collector-Emitter Voltage  
Collector Current  
Symbol  
Value  
50  
Unit  
Vdc  
SOT1123  
CASE 524AA  
STYLE 1  
V
CBO  
V
CEO  
50  
Vdc  
I
C
100  
mAdc  
MARKING DIAGRAM  
Stresses exceeding Maximum Ratings may damage the device. Maximum  
Ratings are stress ratings only. Functional operation above the Recommended  
Operating Conditions is not implied. Extended exposure to stresses above the  
Recommended Operating Conditions may affect device reliability.  
x M  
x
M
= Device Code  
= Date Code  
G or G = PbFree Package  
ORDERING INFORMATION  
Device  
Package  
Shipping  
NSBA114EFT5G SOT1123 8000/Tape & Reel  
(PbFree)  
†For information on tape and reel specifications,  
including part orientation and tape sizes, please  
refer to our Tape and Reel Packaging Specifications  
Brochure, BRD8011/D.  
DEVICE MARKING INFORMATION  
See specific marking information in the device marking table  
on page 2 of this data sheet.  
©
Semiconductor Components Industries, LLC, 2008  
1
Publication Order Number:  
September, 2008 Rev. 2  
NSBA114EF3/D  

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