NSBA114EDXV6T1,
NSBA114EDXV6T5 SERIES
Preferred Devices
Dual Bias Resistor
Transistors
PNP Silicon Surface Mount Transistors
with Monolithic Bias Resistor Network
http://onsemi.com
(3)
(2)
(1)
The BRT (Bias Resistor Transistor) contains a single transistor with
a monolithic bias network consisting of two resistors; a series base
resistor and a base−emitter resistor. These digital transistors are
designed to replace a single device and its external resistor bias
network. The BRT eliminates these individual components by
integrating them into a single device. In the NSBA114EDXV6T1
series, two BRT devices are housed in the SOT−563 package which is
ideal for low−power surface mount applications where board space is
at a premium.
R
1
R
2
Q
1
Q
2
R
2
R
1
(4)
(5)
(6)
SOT−563
Features
CASE 463A
PLASTIC
STYLE 1
• Simplifies Circuit Design
• Reduces Board Space
• Reduces Component Count
• These are Pb−Free Devices
1
MARKING DIAGRAM
MAXIMUM RATINGS
(T = 25°C unless otherwise noted, common for Q and Q )
A
xx M G
1
2
G
Rating
Symbol
Value
−50
Unit
Collector-Base Voltage
V
V
Vdc
CBO
CEO
Collector-Emitter Voltage
Collector Current
−50
Vdc
xx = Device Code
(Refer to page 2)
I
−100
mAdc
C
M
= Date Code
THERMAL CHARACTERISTICS
G
= Pb−Free Package
(Note: Microdot may be in either location)
Characteristic
(One Junction Heated)
Symbol
Max
Unit
ORDERING INFORMATION
Total Device Dissipation @ T = 25°C
P
357
2.9
mW
mW/°C
A
D
†
Derate above 25°C (Note 1)
Shipping
Device
Package
Thermal Resistance, Junction-to-Ambient
(Note 1)
R
350
°C/W
q
JA
NSBA1xxxDXV6T1 SOT−563* 4000/Tape & Reel
NSBA1xxxDXV6T1G SOT−563* 4000/Tape & Reel
Characteristic
(Both Junctions Heated)
NSBA1xxxDXV6T5 SOT−563* 8000/Tape & Reel
NSBA1xxxDXV6T5G SOT−563* 8000/Tape & Reel
Symbol
Max
Unit
Total Device Dissipation @ T = 25°C
P
500
4.0
mW
mW/°C
A
D
Derate above 25°C (Note 1)
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
Thermal Resistance, Junction-to-Ambient
(Note 1)
R
q
250
°C/W
JA
Junction and Storage Temperature
Range
T , T
J
−55 to
+150
°C
stg
**This package is inherently Pb−Free.
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. FR−4 @ Minimum Pad
DEVICE MARKING INFORMATION
See specific marking information in the device marking table
on page 2 of this data sheet.
Preferred devices are recommended choices for future use
and best overall value.
©
Semiconductor Components Industries, LLC, 2006
1
Publication Order Number:
April, 2006 − Rev. 6
NSBA114EDXV6/D