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NLVAC11DR2G PDF预览

NLVAC11DR2G

更新时间: 2024-11-27 11:01:43
品牌 Logo 应用领域
安森美 - ONSEMI 光电二极管逻辑集成电路
页数 文件大小 规格书
9页 131K
描述
Triple 3-Input AND Gate

NLVAC11DR2G 技术参数

是否无铅: 不含铅生命周期:Active
包装说明:SOP,针数:14
Reach Compliance Code:compliant风险等级:5.65
系列:ACJESD-30 代码:R-PDSO-G14
JESD-609代码:e3长度:8.65 mm
逻辑集成电路类型:AND GATE湿度敏感等级:1
功能数量:3输入次数:3
端子数量:14最高工作温度:85 °C
最低工作温度:-40 °C封装主体材料:PLASTIC/EPOXY
封装代码:SOP封装形状:RECTANGULAR
封装形式:SMALL OUTLINE传播延迟(tpd):10 ns
座面最大高度:1.75 mm最大供电电压 (Vsup):6 V
最小供电电压 (Vsup):2 V标称供电电压 (Vsup):5 V
表面贴装:YES技术:CMOS
温度等级:INDUSTRIAL端子面层:Tin (Sn)
端子形式:GULL WING端子节距:1.27 mm
端子位置:DUAL宽度:3.9 mm
Base Number Matches:1

NLVAC11DR2G 数据手册

 浏览型号NLVAC11DR2G的Datasheet PDF文件第2页浏览型号NLVAC11DR2G的Datasheet PDF文件第3页浏览型号NLVAC11DR2G的Datasheet PDF文件第4页浏览型号NLVAC11DR2G的Datasheet PDF文件第5页浏览型号NLVAC11DR2G的Datasheet PDF文件第6页浏览型号NLVAC11DR2G的Datasheet PDF文件第7页 
MC74AC11, MC74ACT11  
Triple 3−Input AND Gate  
Features  
Outputs Source/Sink 24 mA  
ACT11 Has TTL Compatible Inputs  
PbFree Packages are Available  
http://onsemi.com  
PDIP14  
N SUFFIX  
CASE 646  
V
CC  
14  
13  
12  
11  
10  
9
8
14  
1
SOIC14  
D SUFFIX  
CASE 751A  
14  
1
1
2
3
4
5
6
7
GND  
SOEIAJ14  
M SUFFIX  
CASE 965  
Figure 1. Pinout: 14Lead Packages Conductors  
14  
(Top View)  
1
MAXIMUM RATINGS  
Rating  
Symbol  
Value  
Unit  
ORDERING INFORMATION  
See detailed ordering and shipping information in the package  
dimensions section on page 5 of this data sheet.  
DC Supply Voltage (Referenced to GND)  
V
0.5 to  
+7.0  
V
CC  
DC Input Voltage (Referenced to GND)  
DC Output Voltage (Referenced to GND)  
V
0.5 to  
CC  
V
V
in  
V
+0.5  
V
out  
0.5 to  
V
+0.5  
CC  
DC Input Current, per Pin  
I
±20  
mA  
mA  
mA  
°C  
in  
DC Output Sink/Source Current, per Pin  
I
I
±50  
±50  
out  
CC  
DC V or GND Current per Output Pin  
CC  
Storage Temperature  
T
stg  
65 to  
+150  
Stresses exceeding Maximum Ratings may damage the device. Maximum  
Ratings are stress ratings only. Functional operation above the Recommended  
Operating Conditions is not implied. Extended exposure to stresses above the  
Recommended Operating Conditions may affect device reliability.  
©
Semiconductor Components Industries, LLC, 2006  
1
Publication Order Number:  
October, 2006 Rev. 7  
MC74AC11/D  

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