是否无铅: | 不含铅 | 生命周期: | Active |
包装说明: | VSSOP, TSSOP8,.12,20 | 针数: | 8 |
Reach Compliance Code: | compliant | HTS代码: | 8542.39.00.01 |
Factory Lead Time: | 8 weeks | 风险等级: | 1.33 |
接口集成电路类型: | INTERFACE CIRCUIT | JESD-30 代码: | R-PDSO-G8 |
JESD-609代码: | e3 | 长度: | 2.3 mm |
湿度敏感等级: | 1 | 功能数量: | 2 |
端子数量: | 8 | 最高工作温度: | 125 °C |
最低工作温度: | -55 °C | 封装主体材料: | PLASTIC/EPOXY |
封装代码: | VSSOP | 封装等效代码: | TSSOP8,.12,20 |
封装形状: | RECTANGULAR | 封装形式: | SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH |
峰值回流温度(摄氏度): | NOT SPECIFIED | 认证状态: | Not Qualified |
筛选级别: | AEC-Q100 | 座面最大高度: | 0.9 mm |
子类别: | Other Interface ICs | 表面贴装: | YES |
温度等级: | MILITARY | 端子面层: | Tin (Sn) |
端子形式: | GULL WING | 端子节距: | 0.5 mm |
端子位置: | DUAL | 处于峰值回流温度下的最长时间: | NOT SPECIFIED |
宽度: | 2 mm | Base Number Matches: | 1 |
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