MC14069UB
Hex Inverter
The MC14069UB hex inverter is constructed with MOS P−channel
and N−channel enhancement mode devices in a single monolithic
structure. These inverters find primary use where low power
dissipation and/or high noise immunity is desired. Each of the six
inverters is a single stage to minimize propagation delays.
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Features
• Supply Voltage Range = 3.0 Vdc to 18 Vdc
• Capable of Driving Two Low−Power TTL Loads or One
Low−Power Schottky TTL Load Over the Rated Temperature
Range
SOIC−14
D SUFFIX
CASE 751A
SOEIAJ−14
F SUFFIX
CASE 965
TSSOP−14
DT SUFFIX
CASE 948G
• Triple Diode Protection on All Inputs
• Pin−for−Pin Replacement for CD4069UB
• Meets JEDEC UB Specifications
PIN ASSIGNMENT
• NLV Prefix for Automotive and Other Applications Requiring
Unique Site and Control Change Requirements; AEC−Q100
Qualified and PPAP Capable
1
2
3
4
5
6
7
IN 1
14
13
V
DD
IN 6
OUT 1
IN 2
12 OUT 6
• These Devices are Pb−Free and are RoHS Compliant
11
10
9
IN 5
OUT 2
IN 3
MAXIMUM RATINGS (Voltages Referenced to V
)
OUT 5
IN 4
SS
OUT 3
Symbol
Parameter
Value
−0.5 to +18.0
Unit
V
V
SS
8
OUT 4
V
DD
DC Supply Voltage Range
V , V
in out
Input or Output Voltage Range
(DC or Transient)
−0.5 to V + 0.5
V
DD
MARKING DIAGRAMS
I , I
Input or Output Current
(DC or Transient) per Pin
10
mA
in out
14
14
1
P
D
Power Dissipation, per Package
(Note 1)
500
mW
14069UG
AWLYWW
MC14069UB
ALYWG
T
A
Ambient Temperature Range
Storage Temperature Range
−55 to +125
−65 to +150
260
°C
°C
°C
1
T
stg
SOIC−14
SOEIAJ−14
T
L
Lead Temperature
(8−Second Soldering)
14
1
14
069U
ALYWG
G
Stresses exceeding those listed in the Maximum Ratings table may damage the
device. If any of these limits are exceeded, device functionality should not be
assumed, damage may occur and reliability may be affected.
1. Temperature Derating: “D/DW” Packages: –7.0 mW/_C From 65_C To 125_C
This device contains protection circuitry to guard against damage due to high
static voltages or electric fields. However, precautions must be taken to avoid
applications of any voltage higher than maximum rated voltages to this
TSSOP−14
A
WL, L
YY, Y
= Assembly Location
= Wafer Lot
= Year
high−impedance circuit. For proper operation, V and V should be constrained
in
out
to the range V ≤ (V or V ) ≤ V .
SS
in
out
DD
Unused inputs must always be tied to an appropriate logic voltage level
(e.g., either V or V ). Unused outputs must be left open.
WW, W = Work Week
SS
DD
G or G
= Pb−Free Package
(Note: Microdot may be in either location)
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 2 of this data sheet.
© Semiconductor Components Industries, LLC, 2014
1
Publication Order Number:
August, 2014 − Rev. 11
MC14069UB/D