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NL7SZ57DBVT1G PDF预览

NL7SZ57DBVT1G

更新时间: 2024-10-03 11:01:47
品牌 Logo 应用领域
安森美 - ONSEMI 光电二极管逻辑集成电路
页数 文件大小 规格书
8页 138K
描述
可配置多函数门极(9 个可选择函数)

NL7SZ57DBVT1G 技术参数

是否无铅: 不含铅生命周期:Active
包装说明:SC-74, 6 PINReach Compliance Code:compliant
Factory Lead Time:43 weeks 1 day风险等级:5.66
系列:LVC/LCX/ZJESD-30 代码:R-PDSO-G6
长度:3 mm逻辑集成电路类型:LOGIC CIRCUIT
功能数量:1端子数量:6
最高工作温度:125 °C最低工作温度:-55 °C
封装主体材料:PLASTIC/EPOXY封装代码:TSOP
封装等效代码:TSOP6,.11,37封装形状:RECTANGULAR
封装形式:SMALL OUTLINE, THIN PROFILE包装方法:TR
座面最大高度:1.1 mm最大供电电压 (Vsup):5.5 V
最小供电电压 (Vsup):1.65 V标称供电电压 (Vsup):3.3 V
表面贴装:YES技术:CMOS
温度等级:MILITARY端子形式:GULL WING
端子节距:0.95 mm端子位置:DUAL
宽度:1.5 mmBase Number Matches:1

NL7SZ57DBVT1G 数据手册

 浏览型号NL7SZ57DBVT1G的Datasheet PDF文件第2页浏览型号NL7SZ57DBVT1G的Datasheet PDF文件第3页浏览型号NL7SZ57DBVT1G的Datasheet PDF文件第4页浏览型号NL7SZ57DBVT1G的Datasheet PDF文件第5页浏览型号NL7SZ57DBVT1G的Datasheet PDF文件第6页浏览型号NL7SZ57DBVT1G的Datasheet PDF文件第7页 
NL7SZ57  
Configurable Multifunction  
Gate  
The NL7SZ57 is an advanced highspeed CMOS multifunction  
gate. The device allows the user to choose logic functions AND, OR,  
NAND, NOR, XNOR, INVERT and BUFFER. The device has  
Schmitttrigger inputs, thereby enhancing noise immunity.  
http://onsemi.com  
The NL7SZ57 input and output structures provide protection when  
voltages up to 7.0 V are applied, irregardless of the supply voltage.  
1
Features  
SC88 (SOT363)  
CASE 419B  
High Speed: t = 3.2 ns (Typ) @ V = 5.0 V  
PD  
CC  
Low Power Dissipation: I = 1 mA (Maximum) at T = 25°C  
CC  
A
Power Down Protection Provided on inputs  
MARKING DIAGRAM  
Balanced Propagation Delays  
Overvoltage Tolerant (OVT) Input and Output Pins  
UltraSmall Package  
6
MN MG  
G
This is a PbFree Device  
1
MN  
M
= Specific Device Code  
= Date Code*  
G
= PbFree Package  
(Note: Microdot may be in either location)  
*Date Code orientation and/or position may  
vary depending upon manufacturing location.  
PIN ASSIGNMENTS  
IN B  
GND  
IN A  
IN C  
1
2
6
5
4
V
CC  
OUT Y  
3
(Top View)  
ORDERING INFORMATION  
See detailed ordering and shipping information in the package  
dimensions section on page 7 of this data sheet.  
© Semiconductor Components Industries, LLC, 2009  
1
Publication Order Number:  
June, 2009 Rev. 2  
NL7SZ57/D  

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