Noise Suppression Products/EMI Suppression Filters > Chip EMIFILr LC Combined Type > Winding Type
Data Sheet
1
Chip EMIFILr LC Combined Type
NFW31SP Series (1206 Size)
I Dimension
I IL of Main Items
(50Ω - 50Ω)
0
2.3 0.2
NFW31SP157X1E4
NFW31SP207X1E4
20
NFW31SP307X1E4
NFW31SP407X1E4
NFW31SP507X1E4
1.6 0.2
3.2 0.3
(2)
40
NFW31SP106X1E4
NFW31SP206X1E4
NFW31SP506X1E4
NFW31SP107X1E4
(3)
(1)
(1) : Input electrode
(2) : Ground electrode
(3) : Output electrode
60
80
∗No polarity.
0.7 0.3
0.7 0.3
1
5
10
50
100
500 1000 2000
0.65 0.2
(in mm)
Frequency (MHz)
I Equivalent Circuit
I Packaging
Code
Packaging
Minimum Quantity
L
180mm Plastic Tape
330mm Plastic Tape
2000
7500
K
(1) Input
Output (3)
GND
(2)
No polarity.
I Rated Value (p: packaging code)
Insertion Loss
Operating
Part Number
Nominal Cut-off Freq.
Attenuation at 500MHz
Attenuation at 1000MHz
Rated Current
Rated Voltage
Number of Circuit
(Cut-off Frequency)
Temperature Range
NFW31SP106X1E4p
NFW31SP206X1E4p
NFW31SP506X1E4p
NFW31SP107X1E4p
NFW31SP157X1E4p
NFW31SP207X1E4p
NFW31SP307X1E4p
NFW31SP407X1E4p
NFW31SP507X1E4p
10MHz
20MHz
6dB max.
6dB max.
6dB max.
6dB max.
6dB max.
6dB max.
6dB max.
6dB max.
6dB max.
30dBmin.
30dBmin.
30dBmin.
20dBmin.
30dBmin.
10dBmin.
5dBmin.
-
30dBmin.
30dBmin.
30dBmin.
30dBmin.
30dBmin.
30dBmin.
15dBmin.
10dBmin.
10dBmin.
200mA
200mA
200mA
200mA
200mA
200mA
200mA
200mA
200mA
25Vdc
25Vdc
25Vdc
25Vdc
25Vdc
25Vdc
25Vdc
25Vdc
25Vdc
-40°C to 85°C
-40°C to 85°C
-40°C to 85°C
-40°C to 85°C
-40°C to 85°C
-40°C to 85°C
-40°C to 85°C
-40°C to 85°C
-40°C to 85°C
1
1
1
1
1
1
1
1
1
50MHz
100MHz
150MHz
200MHz
300MHz
400MHz
500MHz
6dBmax.
I !Caution/Notice
!Caution (Rating)
Notice
Do not use products beyond the rated current and
rated voltage as this may create excessive heat
and deteriorate the insulation resistance .
Solderability of Tin plating termination chip might be
deteriorated when low temperature soldering profile
where peak solder temperature is below the Tin melting
point is used. Please confirm the solderability of Tin
plating termination chip before use.
o
This data sheet is applied for LC Combined CHIP EMIFILr used for General Electronics equipment for your design.
2005.3.4
http://www.murata.com/