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NDF11N50Z PDF预览

NDF11N50Z

更新时间: 2024-02-15 03:27:08
品牌 Logo 应用领域
安森美 - ONSEMI /
页数 文件大小 规格书
7页 109K
描述
N-Channel Power MOSFET 500 V, 0.52 

NDF11N50Z 技术参数

是否无铅: 不含铅生命周期:End Of Life
零件包装代码:TO-220AB包装说明:HALOGEN FREE AND ROHS COMPLIANT, PLASTIC, CASE 221AH, TO-220FP, 3 PIN
针数:3Reach Compliance Code:not_compliant
ECCN代码:EAR99风险等级:5.2
雪崩能效等级(Eas):420 mJ外壳连接:ISOLATED
配置:SINGLE WITH BUILT-IN DIODE最小漏源击穿电压:500 V
最大漏极电流 (Abs) (ID):12 A最大漏极电流 (ID):12 A
最大漏源导通电阻:0.52 ΩFET 技术:METAL-OXIDE SEMICONDUCTOR
JEDEC-95代码:TO-220ABJESD-30 代码:R-PSFM-T3
JESD-609代码:e3元件数量:1
端子数量:3工作模式:ENHANCEMENT MODE
最高工作温度:150 °C封装主体材料:PLASTIC/EPOXY
封装形状:RECTANGULAR封装形式:FLANGE MOUNT
峰值回流温度(摄氏度):NOT SPECIFIED极性/信道类型:N-CHANNEL
最大功率耗散 (Abs):39 W最大脉冲漏极电流 (IDM):44 A
子类别:FET General Purpose Power表面贴装:NO
端子面层:Tin (Sn)端子形式:THROUGH-HOLE
端子位置:SINGLE处于峰值回流温度下的最长时间:NOT SPECIFIED
晶体管元件材料:SILICONBase Number Matches:1

NDF11N50Z 数据手册

 浏览型号NDF11N50Z的Datasheet PDF文件第2页浏览型号NDF11N50Z的Datasheet PDF文件第3页浏览型号NDF11N50Z的Datasheet PDF文件第4页浏览型号NDF11N50Z的Datasheet PDF文件第5页浏览型号NDF11N50Z的Datasheet PDF文件第6页浏览型号NDF11N50Z的Datasheet PDF文件第7页 
NDF11N50Z, NDP11N50Z  
N-Channel Power MOSFET  
500 V, 0.52 W  
Features  
Low ON Resistance  
Low Gate Charge  
http://onsemi.com  
100% Avalanche Tested  
These Devices are PbFree and are RoHS Compliant  
V
R
(MAX) @ 4.5 A  
DS(ON)  
DSS  
ABSOLUTE MAXIMUM RATINGS (T = 25°C unless otherwise noted)  
C
500 V  
0.52 Ω  
Rating  
Symbol NDF11N50Z NDP11N50Z Unit  
DraintoSource Voltage  
V
500  
V
A
DSS  
NChannel  
Continuous Drain Current,  
R
I
D
10.5 (Note  
2)  
10.5  
6.7  
42  
D (2)  
q
JC  
Continuous Drain Current  
I
D
6.7 (Note 2)  
42 (Note 2)  
36  
A
A
T = 100°C, R  
q
JC  
A
Pulsed Drain Current,  
@ 10 V  
I
DM  
V
GS  
G (1)  
Power Dissipation, R  
(Note 1)  
P
145  
W
q
JC  
D
GatetoSource Voltage  
V
GS  
30  
V
S (3)  
TO220FP  
CASE 221D  
STYLE 1  
Single Pulse Avalanche  
E
AS  
190  
mJ  
MARKING  
DIAGRAM  
Energy, I = 10.5 A  
D
ESD (HBM)  
(JESD22A114)  
V
4000  
V
V
esd  
RMS Isolation Voltage  
V
ISO  
4500  
(t = 0.3 sec., R.H. 30%,  
T = 25°C) (Figure 14)  
A
NDF11N50ZG  
or  
NDP11N50ZG  
AYWW  
Peak Diode Recovery  
dv/dt  
4.5 (Note 3)  
10.5  
V/ns  
A
Continuous Source Cur-  
rent (Body Diode)  
I
S
Gate  
Source  
Maximum Temperature for  
Soldering Leads  
T
260  
°C  
°C  
L
TO220  
CASE 221A  
STYLE 5  
Operating Junction and  
T , T  
55 to 150  
J
stg  
Storage Temperature Range  
Drain  
Stresses exceeding Maximum Ratings may damage the device. Maximum  
Ratings are stress ratings only. Functional operation above the Recommended  
Operating Conditions is not implied. Extended exposure to stresses above the  
Recommended Operating Conditions may affect device reliability.  
A
Y
WW  
G
= Location Code  
= Year  
= Work Week  
= PbFree Package  
1. Surface mounted on FR4 board using 1sq. pad size, (Cu area = 1.127 in sq  
[2 oz] including traces).  
2. Limited by maximum junction temperature  
3. I 10.5 A, di/dt 200 A/ms, V BV  
, T 150°C.  
J
d
DD  
DSS  
ORDERING INFORMATION  
See detailed ordering and shipping information in the package  
dimensions section on page 6 of this data sheet.  
© Semiconductor Components Industries, LLC, 2010  
1
Publication Order Number:  
July, 2010 Rev. 0  
NDF11N50Z/D  
 

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