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NDF06N60Z PDF预览

NDF06N60Z

更新时间: 2024-01-31 23:21:50
品牌 Logo 应用领域
安森美 - ONSEMI /
页数 文件大小 规格书
6页 134K
描述
NDP06N60Z

NDF06N60Z 技术参数

是否无铅: 不含铅生命周期:End Of Life
零件包装代码:TO-220AB包装说明:HALOGEN FREE AND ROHS COMPLIANT, CASE 221D-03, TO-220, FULL PACK-3
针数:3Reach Compliance Code:not_compliant
ECCN代码:EAR99Factory Lead Time:1 week
风险等级:6.2Samacsys Confidence:3
Samacsys Status:ReleasedSamacsys PartID:226547
Samacsys Pin Count:3Samacsys Part Category:Transistor
Samacsys Package Category:Transistor Outline, VerticalSamacsys Footprint Name:TO-220 FULLPAK CASE 221AH ISSUE F
Samacsys Released Date:2015-11-03 12:30:39Is Samacsys:N
雪崩能效等级(Eas):113 mJ外壳连接:ISOLATED
配置:SINGLE WITH BUILT-IN DIODE最小漏源击穿电压:600 V
最大漏极电流 (Abs) (ID):7.1 A最大漏极电流 (ID):7.1 A
最大漏源导通电阻:1.2 ΩFET 技术:METAL-OXIDE SEMICONDUCTOR
JEDEC-95代码:TO-220ABJESD-30 代码:R-PSFM-T3
JESD-609代码:e3元件数量:1
端子数量:3工作模式:ENHANCEMENT MODE
最高工作温度:150 °C封装主体材料:PLASTIC/EPOXY
封装形状:RECTANGULAR封装形式:FLANGE MOUNT
峰值回流温度(摄氏度):NOT SPECIFIED极性/信道类型:N-CHANNEL
最大功率耗散 (Abs):35 W最大脉冲漏极电流 (IDM):28 A
认证状态:Not Qualified子类别:FET General Purpose Power
表面贴装:NO端子面层:Tin (Sn)
端子形式:THROUGH-HOLE端子位置:SINGLE
处于峰值回流温度下的最长时间:NOT SPECIFIED晶体管元件材料:SILICON
Base Number Matches:1

NDF06N60Z 数据手册

 浏览型号NDF06N60Z的Datasheet PDF文件第2页浏览型号NDF06N60Z的Datasheet PDF文件第3页浏览型号NDF06N60Z的Datasheet PDF文件第4页浏览型号NDF06N60Z的Datasheet PDF文件第5页浏览型号NDF06N60Z的Datasheet PDF文件第6页 
NDF06N60Z, NDP06N60Z  
N-Channel Power MOSFET  
0.98 W, 600 Volts  
Features  
Low ON Resistance  
Low Gate Charge  
http://onsemi.com  
100% Avalanche Tested  
These Devices are PbFree and are RoHS Compliant  
V
DSS  
R
(TYP) @ 3 A  
DS(ON)  
Applications  
600 V  
0.98 Ω  
Adapter (Notebook, Printer, Gaming)  
LCD Panel Power  
NChannel  
Lighting Ballasts  
D (2)  
ABSOLUTE MAXIMUM RATINGS (T = 25°C unless otherwise noted)  
C
Rating  
Symbol NDF06N60Z NDP06N60Z Unit  
DraintoSource Voltage  
Continuous Drain Current  
Continuous Drain Current  
V
600 (Note 1)  
6.0 (Note 2)  
3.8 (Note 2)  
V
A
A
DSS  
I
D
G (1)  
I
D
T = 100°C  
A
S (3)  
Pulsed Drain Current,  
I
20 (Note 2)  
A
TO220FP  
CASE 221D  
STYLE 1  
DM  
V
GS  
@ 10 V  
MARKING  
DIAGRAM  
Power Dissipation (Note 1)  
P
31  
113  
W
V
D
GatetoSource Voltage  
V
30  
GS  
Single Pulse Avalanche  
Energy, L = 6.3 mH,  
E
AS  
113  
mJ  
I
D
= 6.0 A  
ESD (HBM)  
(JESD 22114B)  
V
3000  
V
V
NDF06N60ZG  
or  
NDP06N60ZG  
AYWW  
esd  
ISO  
RMS Isolation Voltage  
(t = 0.3 sec., R.H. 30%,  
T = 25°C) (Figure 13)  
A
V
4500  
Gate  
Source  
TO220AB  
CASE 221A  
STYLE 5  
Peak Diode Recovery  
dv/dt  
4.5 (Note 3)  
6.0  
V/ns  
A
Continuous Source  
I
S
Current (Body Diode)  
Drain  
Maximum Temperature for  
Soldering Leads, 0.063″  
(1.6 mm) from Case for  
10 s Package Body for 10 s  
T
300  
260  
°C  
L
A
Y
WW  
G
= Location Code  
= Year  
= Work Week  
= PbFree Package  
T
PKG  
Operating Junction and  
T , T  
55 to 150  
°C  
J
stg  
Storage Temperature Range  
Stresses exceeding Maximum Ratings may damage the device. Maximum  
Ratings are stress ratings only. Functional operation above the Recommended  
Operating Conditions is not implied. Extended exposure to stresses above the  
Recommended Operating Conditions may affect device reliability.  
ORDERING INFORMATION  
Device  
Package  
TO220FP  
TO220AB  
Shipping  
50 Units/Rail  
In Development  
1. Surface mounted on FR4 board using 1sq. pad size, 1 oz cu  
NDF06N60ZG  
NDP06N60ZG  
2. Limited by maximum junction temperature  
3. I = 6.0 A, di/dt 100 A/ms, V BV  
, T = +150°C  
J
SD  
DD  
DSS  
© Semiconductor Components Industries, LLC, 2009  
1
Publication Order Number:  
June, 2009 Rev. 0  
NDF06N60Z/D  
 

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