NDD60N360U1
N-Channel Power MOSFET
600 V, 360 mW
Features
• 100% Avalanche Tested
• These Devices are Pb-Free, Halogen Free/BFR Free and are RoHS
http://onsemi.com
R
Compliant
V
MAX
DS(ON)
ABSOLUTE MAXIMUM RATINGS (T = 25°C unless otherwise noted)
(BR)DSS
J
Parameter
Drain−to−Source Voltage
Gate−to−Source Voltage
Symbol
NDD
600
25
Unit
V
600 V
360 mW @ 10 V
V
DSS
V
GS
V
N−Channel MOSFET
D (2)
Continuous Drain
Current R
Steady
State
T
= 25°C
I
D
11
A
C
q
JC
T
C
= 100°C
6.9
114
Power Dissipation –
R
Steady
State
T
= 25°C
P
D
W
A
C
q
JC
G (1)
Pulsed Drain
Current
t = 10 ms
I
44
p
DM
S (3)
Operating Junction and Storage
Temperature
T ,
STG
−55 to
+150
°C
J
T
Source Current (Body Diode)
I
13
64
A
S
4
Single Pulse Drain−to−Source Avalanche
EAS
mJ
Energy (I = 3.5 A)
D
RMS Isolation Voltage (t = 0.3 sec.,
V
ISO
−
V
1
R.H. ≤ 30%, T = 25°C) (Figure 15)
2
A
3
Peak Diode Recovery (Note 1)
15
V/ns
dv/dt
IPAK
CASE 369D
Lead Temperature for Soldering Leads
T
L
260
°C
4
Stresses exceeding those listed in the Maximum Ratings table may damage the
device. If any of these limits are exceeded, device functionality should not be
assumed, damage may occur and reliability may be affected.
4
1. I ≤ 13 A, di/dt ≤ 400 A/ms, V
≤ V
, V = 80% V
SD
DS peak
(BR)DSS DD (BR)DSS
2
1
1
3
3
DPAK
CASE 369C
2
THERMAL RESISTANCE
Parameter
IPAK
CASE 369AD
Symbol
Value
Unit
°C/W
°C/W
Junction−to−Case (Drain)
R
R
1.1
q
JC
JA
Junction−to−Ambient Steady State
q
(Note 3)
(Note 2)
(Note 2)
NDD60N360U1
NDD60N360U1−1
NDD60N360U1−35G
47
98
95
MARKING AND ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 3 of this data sheet.
2. Insertion mounted
3. Surface mounted on FR4 board using 1″ sq. pad size
(Cu area = 1.127 in sq [2 oz] including traces)
© Semiconductor Components Industries, LLC, 2014
1
Publication Order Number:
January, 2014 − Rev. 0
NDD60N360U1/D