是否无铅: | 不含铅 | 生命周期: | Active |
零件包装代码: | MSOP | 包装说明: | TSSOP, |
针数: | 8 | Reach Compliance Code: | compliant |
HTS代码: | 8542.39.00.01 | Factory Lead Time: | 1 week |
风险等级: | 1.36 | Samacsys Confidence: | 3 |
Samacsys Status: | Released | Samacsys PartID: | 226363 |
Samacsys Pin Count: | 8 | Samacsys Part Category: | Integrated Circuit |
Samacsys Package Category: | Small Outline Packages | Samacsys Footprint Name: | MICRO8 CASE 846A-02 ISSUE H |
Samacsys Released Date: | 2015-08-20 09:23:38 | Is Samacsys: | N |
模拟集成电路 - 其他类型: | ANALOG CIRCUIT | JESD-30 代码: | S-PDSO-G8 |
JESD-609代码: | e3 | 长度: | 3 mm |
湿度敏感等级: | 1 | 功能数量: | 1 |
端子数量: | 8 | 最高工作温度: | 125 °C |
最低工作温度: | -55 °C | 封装主体材料: | PLASTIC/EPOXY |
封装代码: | TSSOP | 封装形状: | SQUARE |
封装形式: | SMALL OUTLINE | 峰值回流温度(摄氏度): | 260 |
认证状态: | Not Qualified | 座面最大高度: | 1.1 mm |
最大供电电压 (Vsup): | 5.5 V | 最小供电电压 (Vsup): | 3 V |
标称供电电压 (Vsup): | 3.3 V | 表面贴装: | YES |
温度等级: | MILITARY | 端子面层: | Tin (Sn) |
端子形式: | GULL WING | 端子节距: | 0.65 mm |
端子位置: | DUAL | 处于峰值回流温度下的最长时间: | NOT SPECIFIED |
宽度: | 3 mm | Base Number Matches: | 1 |
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