nanoX-BT
Extreme Rugged COM Express® Mini Size Type 10 Module with
Intel Atom® E3800 series or Celeron® Processor SoC
Features
Single, dual, quad-core Intel Atom® or Celeron® Processor SoC
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Up to 4GB soldered Dual Channel DDR3L at 1333MHz
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One DDI channel, one LVDS (build option, eDP)
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Three PCIe x1
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GbE, two SATA 3Gb/s, four USB and one USB client
Supports Smart Embedded Management Agent (SEMA®) functions
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Extreme Rugged operating temperature: -40°C to +85°C
(build option)
Specifications
● Core System
CPU
Debug Headers
Single, dual, quad-core Intel Atom® or quad-core Celeron®
40-pin multipurpose flat cable connector
Use in combination with DB-40 debug module
providing BIOS POST code LED, BMC access, SPI BIOS flashing, power test points,
debug LEDs
Atom® E3845 1.91 GHz 542/792 Gfx (Turbo) 10W (4C/1333)
Atom® E3827 1.75 GHz 542/792 Gfx (Turbo) 8W (2C/1333)
Atom® E3826 1.46 GHz 533/667 Gfx (Turbo) 7W (2C/1066)
Atom® E3825 1.33 GHz 533 Gfx (No Turbo) 6W (2C/1066)
Atom® E3815 1.46 GHz 400 Gfx (No Turbo) 5W (1C/1066) Atom® E3805 1.33 GHz
(No GFX) 3W (2C/1066)
60-pin XDP header for ICE debug of CPU/chipset on break out board
GPU Feature Support
7th generation Intel® graphics core architecture with four execution units
supporting two independent displays
Celeron® N2930 1.83/2.16 (Burst) GHz, 313/854 (Turbo) 7.5W (4C/1333)Celeron®
J1900 2.0/2.42 (Burst) GHz, 688/854 (Turbo) 10W (4C/1333)
Supports: Single, dual or quad Out-of-Order Execution (OOE) processor
cores, Intel® VT-x, Intel® SSE4.1 and SSE4.2, Intel® 64 architecture, IA 32-bit ,
PCLMULQDQ Instruction DRNG, Intel® Thermal Monitor (TM1 & TM2)
Note: Availability of features may vary between processor SKUs.
3D graphics hardware acceleration
Supports for DirectX11, OCL 1.1, OGL ES Halt/2.0/1.1, OGL 3.2
Video decode hardware acceleration including support for H.264, MPEG2, MVC,
VC-1, WMV9 and VP8 formats
Memory
Video encode hardware acceleration including support for H.264, MPEG2 and
MVC formats
Single channel non-ECC 1333/1066 MHz soldered DDR3L memory up to 4GB
(2GB or 4GB)
Digital Display Interface
One DDI channel supporting DisplayPort/HDMI/DVI
Embedded BIOS
AMI EFI with CMOS backup in 8MB SPI BIOS
LVDS/eDP
Single channel 18/24-bit LVDS
(BOM option support for 24-bit EDID panel)
Cache
Primary 32 KB, 8-way L1 instruction cache and 24 KB, 6-way L1 write-back data
cache
eDP support (build option)
2MB for E3845, N2930 and J1900
1MB for E3827, E3826, E3825 and E3805
512K for E3815
● Audio
Chipset
Intel® HD Audio integrated in SOC
Expansion Busses
3 PCI Express x1 Gen2 (AB): Ianes 0/1/2;
optional PCIe x4 (lose GbE)
Audio Codec
Located on carrier miniBASE-10R
LPC bus, SMBus (system), I2C (user)
SEMA Board Controller
● Ethernet
Supports: Voltage/Current monitoring, Power sequence debug support, AT/ATX
mode control, Logistics and Forensic information, Flat Panel Control, General
Purpose I2C, Watchdog Timer
Intel® MAC/PHY: Intel® i210LM (MAC/PHY) Ethernet controller
Interface: 10/100/1000 GbE connection
Note: “Build option” indicates an alternative BOM configuration to support additional or alternative functions that are not available on the standard product.
Be aware that part numbers for SKUs with “build options” will need to be created and may cause production lead times.
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