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NANOX-AL-N3350-2G PDF预览

NANOX-AL-N3350-2G

更新时间: 2024-10-31 02:50:51
品牌 Logo 应用领域
凌华 - ADLINK /
页数 文件大小 规格书
4页 444K
描述
COM Express Mini Size Type 10 Module

NANOX-AL-N3350-2G 数据手册

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nanoX-AL  
COM Express Mini Size Type 10 Module with Intel Atom® E3900 series SoC  
and Pentium®/Celeron® SoC  
Features  
Intel Atom® E3900 series (formerly Apollo Lake) and  
Pentium®/Celeron® SoC, supporting full virtualization (VT-d/VT-x)  
Up to 8GB Dual Channel soldered non-ECC DDR3L at 1867/1600MHz  
Newest Intel® Gen9 Low Power graphics, up to 4k resolution and  
H.265 codec  
Multiple PCIe x1 Gen2 (configurable to x2, x4), GbE  
Two SATA 6 Gb/s, two USB 3.0 and six USB 2.0, eMMC 5.0  
(build option)  
Supports Smart Embedded Management Agent (SEMA) functions  
Extreme Rugged operating temperature: -40°C to +85°C  
(build option for E3900 series SKUs)  
Specifications  
Core System  
Video  
CPU  
GPU Feature Support  
Intel Atom® E3900 series (formerly Apollo Lake) and Pentium®/Celeron® SoC  
Intel Atom® E3950 1.6/2.0GHz (Turbo), 12W (4C/1866)  
Intel Atom® E3940 1.6/1.8GHz (Turbo), 9W (4C/1866)  
Intel Atom® E3930 1.3/1.8GHz (Turbo), 6W (2C/1866)  
Intel® Pentium® N4200 1.1/2.5GHz (Turbo), 6W (4C/1866) (by project basis)  
Intel® Celeron® N3350 1.1/2.3GHz (Turbo), 6W (2C/1866) (by project basis)  
Intel® Generation 9 LP Graphics Core Architecture, supporting 2 independent  
and simultaneous display combinations of DisplayPort, HDMI, LVDS or eDP  
outputs  
Hardware encode/transcode (including HEVC)  
DirectX 12, DirectX 11.3, DirectX 10, DirectX 9.3 support  
OpenGL 4.3 and ES 3.0 support  
OpenCL 2.0 support  
Supports: Intel® TXT, Intel® SSE4.2, Intel® 64 Architecture, IA 32-bit, Intel®  
AES-NI, dual or quad Out-of-Order Execution (OOE) processor cores,  
PCLMULQDQ Instruction DRNG  
Digital Display Interface  
DDI0 supportts DisplayPort/HDMI/DVI  
Note: Availability of features may vary between processor SKUs.  
LVDS  
Memory  
Single channel 18/24-bit LVDS from eDP-to-LVDS IC  
Up to 8 GB Dual channel DDR3L at 1867/1600 MHz non-ECC  
2GB is single channel  
eDP  
4/8GB is dual channel  
4 lane support (build option, in place of LVDS)  
Embedded BIOS  
AMI EFI with CMOS backup in 16MB SPI BIOS (dual BIOS by build option)  
Audio  
Chipset  
Intel® HD Audio integrated in SoC  
Cache  
2MB for all SKUs  
Audio Codec  
On carrier miniBASE-10R  
Expansion Busses  
Multiple PCI Express x1 Gen2: Lanes 0/1/2/3 (configurable to 3x1, 1x4,  
1x2+2x1)  
LPC bus, SMBus (system) , I2C (user)  
Ethernet  
Intel® Ethernet Controller I210 (Extreme Rugged operating temperature range)  
Intel® Ethernet Controller I211 (standard operating temperature range)  
Supports IEEE 1588 and GbE0_SDP (I210 only)  
SEMA® Board Controller  
Supports : Voltage/current monitoring, power sequence debug support,  
AT/ATX mode control, logistics and forensic information, flat panel control,  
general purpose I2C, failsafe BIOS (dual BIOS), watchdog timer and fan control  
Debug Headers  
40-pin multipurpose flat cable connector for use with DB-40 debug module  
providing BIOS POST code LED, BMC access, SPI BIOS flashing, power  
testpoints, debug LEDs  
MIPI60 header for ICE debug of CPU/chipset on break out board (build option)  
Note: “build option” indicates an alternative BOM configuration to support additional or alternative functions that are not available on the standard product.  
Be aware that these “build option” part numbers will need to be newly created and this will result in production lead times.  

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