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NAND16GAH0PZA5F PDF预览

NAND16GAH0PZA5F

更新时间: 2024-11-18 20:00:27
品牌 Logo 应用领域
恒忆 - NUMONYX 内存集成电路
页数 文件大小 规格书
32页 697K
描述
Flash, 2GX8, PBGA169, 12 X 16 MM, 1.40 MM HEIGHT, 0.50 MM PITCH, ROHS COMPLIANT, LFBGA-169

NAND16GAH0PZA5F 技术参数

是否无铅: 不含铅是否Rohs认证: 符合
生命周期:Obsolete零件包装代码:BGA
包装说明:LFBGA,针数:169
Reach Compliance Code:unknownECCN代码:3A991.B.1.A
HTS代码:8542.32.00.51风险等级:5.79
JESD-30 代码:R-PBGA-B169JESD-609代码:e1
长度:16 mm内存密度:17179869184 bit
内存集成电路类型:FLASH内存宽度:8
功能数量:1端子数量:169
字数:2147483648 words字数代码:2000000000
工作模式:SYNCHRONOUS最高工作温度:85 °C
最低工作温度:-25 °C组织:2GX8
封装主体材料:PLASTIC/EPOXY封装代码:LFBGA
封装形状:RECTANGULAR封装形式:GRID ARRAY, LOW PROFILE, FINE PITCH
并行/串行:PARALLEL峰值回流温度(摄氏度):245
编程电压:3.3 V认证状态:Not Qualified
座面最大高度:1.4 mm最大供电电压 (Vsup):3.465 V
最小供电电压 (Vsup):3.135 V标称供电电压 (Vsup):3.3 V
表面贴装:YES技术:CMOS
温度等级:OTHER端子面层:Tin/Silver/Copper (Sn/Ag/Cu)
端子形式:BALL端子节距:0.5 mm
端子位置:BOTTOM处于峰值回流温度下的最长时间:30
宽度:12 mmBase Number Matches:1

NAND16GAH0PZA5F 数据手册

 浏览型号NAND16GAH0PZA5F的Datasheet PDF文件第2页浏览型号NAND16GAH0PZA5F的Datasheet PDF文件第3页浏览型号NAND16GAH0PZA5F的Datasheet PDF文件第4页浏览型号NAND16GAH0PZA5F的Datasheet PDF文件第5页浏览型号NAND16GAH0PZA5F的Datasheet PDF文件第6页浏览型号NAND16GAH0PZA5F的Datasheet PDF文件第7页 
NAND16GAH0P  
NAND32GAH0P NAND64GAH0P  
2-Gbyte, 4-Gbyte, 8-Gbyte, 1.8 V/3.3 V supply,  
NAND flash memories with MultiMediaCard™ interface  
Preliminary Data  
Features  
Packaged NAND flash memory with  
MultiMediaCard interface  
2, 4 and 8 Gbytes of formatted data storage  
LFBGA169  
eMMC/MultiMediaCard system specification,  
compliant with V4.3  
Full backward compatibility with previous  
MultiMediaCard system specification  
Bus mode  
LFBGA169 12 x 16 x 1.4 mm (ZA)  
– High-speed MultiMediaCard protocol  
– Three different data bus widths:1 bit, 4 bits,  
8 bits  
Error free memory access  
– Data transfer rate: up to 52 Mbyte/s  
– Internal error correction code  
Operating voltage range:  
– Internal enhanced data management  
algorithm (wear levelling, bad block  
management, garbage collection)  
– V  
=1.8 V/3.3 V  
CCQ  
– V = 3.3 V  
CC  
Multiple block read (x8 at 52 MHz):  
– Possibility for the host to make sudden  
power failure safe-update operations for  
data content  
up to 29 Mbyte/s  
Multiple block write (x8 at 52 MHz):  
up to 19 Mbyte/s  
Security  
Power dissipation  
– Secure erase, secure trim and secure bad  
block erase commands  
– Standby current: down to 100 µA (typ)  
– Read current: down to 70 mA (typ)  
– Write current: down to 100 mA (typ)  
– Disable protection modes (lock/unlock by  
password and device’s permanent write  
protection)  
Trim for data management optimization  
Simple boot sequence method  
– Password protection of data  
– Built-in write protection  
Enhanced power saving method by introducing  
sleep functionality  
Table 1.  
Device summary  
Root part number  
Density  
Package  
Operating voltage  
NAND16GAH0P  
NAND32GAH0P  
NAND64GAH0P  
2 Gbytes  
4 Gbytes  
8 Gbytes  
LFBGA169  
VCC = 3.3 V, VCCQ = 1.8 V/3.3 V  
September 2009  
Rev 3  
1/32  
This is preliminary information on a new product now in development or undergoing evaluation. Details are subject to  
change without notice.  
www.numonyx.com  
1

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