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NAND08GW3C4AZL1F PDF预览

NAND08GW3C4AZL1F

更新时间: 2024-11-23 03:20:07
品牌 Logo 应用领域
恒忆 - NUMONYX 闪存存储内存集成电路
页数 文件大小 规格书
58页 1398K
描述
8/16 Gbit, 2112 byte page, 3 V supply, multilevel, multiplane, NAND Flash memory

NAND08GW3C4AZL1F 技术参数

生命周期:Obsolete零件包装代码:LGA
包装说明:12 X 17 MM, LEAD FREE, ULGA-52针数:52
Reach Compliance Code:unknownECCN代码:3A991.B.1.A
HTS代码:8542.32.00.51风险等级:5.53
最长访问时间:60000 nsJESD-30 代码:R-PBGA-B52
长度:16.9 mm内存密度:8589934592 bit
内存集成电路类型:FLASH内存宽度:8
功能数量:1端子数量:52
字数:1073741824 words字数代码:1000000000
工作模式:ASYNCHRONOUS最高工作温度:70 °C
最低工作温度:组织:1GX8
封装主体材料:PLASTIC/EPOXY封装代码:VBGA
封装形状:RECTANGULAR封装形式:GRID ARRAY, VERY THIN PROFILE
并行/串行:PARALLEL编程电压:3 V
认证状态:Not Qualified座面最大高度:0.65 mm
最大供电电压 (Vsup):3.6 V最小供电电压 (Vsup):2.7 V
标称供电电压 (Vsup):3 V表面贴装:YES
技术:CMOS温度等级:COMMERCIAL
端子形式:BALL端子节距:1 mm
端子位置:BOTTOM类型:NAND TYPE
宽度:12 mmBase Number Matches:1

NAND08GW3C4AZL1F 数据手册

 浏览型号NAND08GW3C4AZL1F的Datasheet PDF文件第2页浏览型号NAND08GW3C4AZL1F的Datasheet PDF文件第3页浏览型号NAND08GW3C4AZL1F的Datasheet PDF文件第4页浏览型号NAND08GW3C4AZL1F的Datasheet PDF文件第5页浏览型号NAND08GW3C4AZL1F的Datasheet PDF文件第6页浏览型号NAND08GW3C4AZL1F的Datasheet PDF文件第7页 
NAND08GW3C2A  
NAND16GW3C4A  
8/16 Gbit, 2112 byte page,  
3 V supply, multilevel, multiplane, NAND Flash memory  
Features  
High density multilevel cell (MLC) Flash  
memory  
– Up to 16 Gbit memory array  
– Up to 512 Mbit spare area  
– Cost-effective solutions for mass storage  
applications  
NAND interface  
TSOP48 12 x 20 mm (N)  
– x 8 bus width  
– Multiplexed address/data  
Supply voltage: V = 2.7 to 3.6 V  
DD  
Page size: (2048 + 64 spare) bytes  
Block size: (256K + 8K spare) bytes  
LGA52 12 x 17 mm (N)  
Multiplane architecture  
– Array split into two independent planes  
– Program/erase operations can be  
Data protection  
performed on both planes at the same time  
– Hardware program/erase locked during  
power transitions  
Page read/program  
– Random access: 60 µs (max)  
– Sequential access: 25 ns (min)  
– Page program operation time: 800 µs (typ)  
Development tools  
– Error correction code models  
– Bad block management and wear leveling  
algorithm  
Multipage program time (2 pages): 800 µs (typ)  
– HW simulation models  
Fast block erase  
Data integrity  
– Block erase time: 2.5 ms (typ)  
– 10,000 program/erase cycles (with ECC)  
– 10 years data retention  
Multiblock erase time (2 blocks): 2.5 ms (typ)  
Status register  
®
ECOPACK packages available  
Electronic signature  
Serial number option  
Chip enable ‘don’t care’  
January 2008  
Rev 2  
1/58  
www.numonyx.com  
1

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