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NAND02GW3B2CN1F PDF预览

NAND02GW3B2CN1F

更新时间: 2024-11-15 04:57:43
品牌 Logo 应用领域
恒忆 - NUMONYX 闪存存储内存集成电路光电二极管
页数 文件大小 规格书
60页 1343K
描述
1-Gbit, 2-Gbit, 2112-byte/1056-word page, 1.8 V/3 V, NAND flash memory

NAND02GW3B2CN1F 技术参数

是否无铅:不含铅是否Rohs认证:符合
生命周期:Transferred零件包装代码:TSOP
包装说明:TSOP1, TSSOP48,.8,20针数:48
Reach Compliance Code:unknownECCN代码:3A991.B.1.A
HTS代码:8542.32.00.51风险等级:5.66
Is Samacsys:N最长访问时间:25000 ns
命令用户界面:YES数据轮询:NO
JESD-30 代码:R-PDSO-G48长度:18.4 mm
内存密度:2147483648 bit内存集成电路类型:FLASH
内存宽度:8功能数量:1
部门数/规模:2K端子数量:48
字数:268435456 words字数代码:256000000
工作模式:ASYNCHRONOUS最高工作温度:70 °C
最低工作温度:组织:256MX8
封装主体材料:PLASTIC/EPOXY封装代码:TSOP1
封装等效代码:TSSOP48,.8,20封装形状:RECTANGULAR
封装形式:SMALL OUTLINE, THIN PROFILE页面大小:2K words
并行/串行:PARALLEL峰值回流温度(摄氏度):NOT SPECIFIED
电源:3/3.3 V编程电压:3 V
认证状态:Not Qualified就绪/忙碌:YES
座面最大高度:1.2 mm部门规模:128K
最大待机电流:0.00005 A子类别:Flash Memories
最大压摆率:0.02 mA最大供电电压 (Vsup):3.6 V
最小供电电压 (Vsup):2.7 V标称供电电压 (Vsup):3 V
表面贴装:YES技术:CMOS
温度等级:COMMERCIAL端子形式:GULL WING
端子节距:0.5 mm端子位置:DUAL
处于峰值回流温度下的最长时间:NOT SPECIFIED切换位:NO
类型:NAND TYPE宽度:12 mm
Base Number Matches:1

NAND02GW3B2CN1F 数据手册

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NAND01G-B2B  
NAND02G-B2C  
1-Gbit, 2-Gbit,  
2112-byte/1056-word page, 1.8 V/3 V, NAND flash memory  
Features  
High density NAND flash memories  
– Up to 2 Gbits of memory array  
– Cost effective solutions for mass storage  
applications  
NAND interface  
– x8 or x16 bus width  
TSOP48 12 x 20 mm  
– Multiplexed address/ data  
– Pinout compatibility for all densities  
FBGA  
Supply voltage: 1.8 V/3.0 V  
Page size  
VFBGA63 9.5 x 12 x 1 mm  
VFBGA63 9 x 11 x 1 mm  
– x8 device: (2048 + 64 spare) bytes  
– x16 device: (1024 + 32 spare) words  
Serial number option  
Block size  
Data protection  
– x8 device: (128 K + 4 K spare) bytes  
– x16 device: (64 K + 2 K spare) words  
– Hardware block locking  
– Hardware program/erase locked during  
power transitions  
Page read/program  
– Random access: 25 µs (max)  
– Sequential access: 30 ns (min)  
– Page program time: 200 µs (typ)  
Data integrity  
– 100 000 program/erase cycles per block  
(with ECC)  
Copy back program mode  
Cache program and cache read modes  
Fast block erase: 2 ms (typ)  
Status register  
– 10 years data retention  
®
ECOPACK packages  
Development tools  
– Error correction code models  
Electronic signature  
– Bad blocks management and wear leveling  
algorithms  
Chip enable ‘don’t care’  
– Hardware simulation models  
Table 1.  
Device summary  
Reference  
Part number  
NAND01GR3B2B, NAND01GW3B2B  
NAND01GR4B2B, NAND01GW4B2B(1)  
NAND02GR3B2C, NAND02GW3B2C  
NAND02GR4B2C, NAND02GW4B2C(1)  
NAND01G-B2B  
NAND02G-B2C  
1. x16 organization only available for MCP products.  
April 2008  
Rev 5  
1/60  
www.numonyx.com  
1

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