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NAND02GR4B2DN6E PDF预览

NAND02GR4B2DN6E

更新时间: 2024-11-15 02:56:39
品牌 Logo 应用领域
恒忆 - NUMONYX 闪存存储内存集成电路光电二极管
页数 文件大小 规格书
69页 1812K
描述
2-Gbit, 2112-byte/1056-word page multiplane architecture, 1.8 V or 3 V, NAND flash memories

NAND02GR4B2DN6E 技术参数

是否无铅:不含铅是否Rohs认证:符合
生命周期:Obsolete零件包装代码:TSOP
包装说明:TSOP1, TSSOP48,.8,20针数:48
Reach Compliance Code:unknownECCN代码:3A991.B.1.A
HTS代码:8542.32.00.51风险等级:5.43
Is Samacsys:N最长访问时间:25000 ns
命令用户界面:YES数据轮询:NO
JESD-30 代码:R-PDSO-G48长度:18.4 mm
内存密度:2147483648 bit内存集成电路类型:FLASH
内存宽度:16功能数量:1
部门数/规模:2K端子数量:48
字数:134217728 words字数代码:128000000
工作模式:ASYNCHRONOUS最高工作温度:85 °C
最低工作温度:-40 °C组织:128MX16
封装主体材料:PLASTIC/EPOXY封装代码:TSOP1
封装等效代码:TSSOP48,.8,20封装形状:RECTANGULAR
封装形式:SMALL OUTLINE, THIN PROFILE页面大小:1K words
并行/串行:PARALLEL峰值回流温度(摄氏度):NOT SPECIFIED
电源:1.8 V编程电压:1.8 V
认证状态:Not Qualified就绪/忙碌:YES
座面最大高度:1.2 mm部门规模:64K
最大待机电流:0.00005 A子类别:Flash Memories
最大压摆率:0.02 mA最大供电电压 (Vsup):1.95 V
最小供电电压 (Vsup):1.7 V标称供电电压 (Vsup):1.8 V
表面贴装:YES技术:CMOS
温度等级:INDUSTRIAL端子形式:GULL WING
端子节距:0.5 mm端子位置:DUAL
处于峰值回流温度下的最长时间:NOT SPECIFIED切换位:NO
类型:NAND TYPE宽度:12 mm
Base Number Matches:1

NAND02GR4B2DN6E 数据手册

 浏览型号NAND02GR4B2DN6E的Datasheet PDF文件第2页浏览型号NAND02GR4B2DN6E的Datasheet PDF文件第3页浏览型号NAND02GR4B2DN6E的Datasheet PDF文件第4页浏览型号NAND02GR4B2DN6E的Datasheet PDF文件第5页浏览型号NAND02GR4B2DN6E的Datasheet PDF文件第6页浏览型号NAND02GR4B2DN6E的Datasheet PDF文件第7页 
NAND02G-B2D  
2-Gbit, 2112-byte/1056-word page  
multiplane architecture, 1.8 V or 3 V, NAND flash memories  
Preliminary Data  
Features  
High density NAND flash memory  
– Up to 2 Gbits of memory array  
– Cost-effective solution for mass storage  
applications  
NAND interface  
– x8 or x16 bus width  
– Multiplexed address/data  
TSOP48 12 x 20 mm (N)  
Supply voltage: 1.8 V or 3.0 V device  
FBGA  
Page size  
– x8 device: (2048 + 64 spare) bytes  
– x16 device: (1024 + 32 spare) words  
VFBGA63 9.5 x 12 mm (ZA)  
Block size  
Status register  
– x8 device: (128 K + 4 K spare) bytes  
– x16 device: (64 K + 2 K spare) words  
Electronic signature  
Chip Enable ‘don’t care’  
Serial number option  
Data protection:  
Multiplane architecture  
– Array split into two independent planes  
– Program/erase operations can be  
performed on both planes at the same time  
– Hardware program/erase disabled during  
power transitions  
Page read/program  
– Non-volatile protection option  
– Random access: 25 µs (max)  
– Sequential access: 25 ns (min)  
– Page program time: 200 µs (typ)  
ONFI 1.0 compliant command set  
Data integrity  
– Multiplane page program time (2 pages):  
200 µs (typ)  
– 100,000 program/erase cycles (with ECC)  
– 10 years data retention  
Copy back program with automatic EDC (error  
®
ECOPACK packages  
detection code)  
Cache read mode  
Table 1.  
Device summary  
Part number  
Fast block erase  
Reference  
– Block erase time: 1.5 ms (typ)  
NAND02GR3B2D  
NAND02GW3B2D  
NAND02GR4B2D(1)  
NAND02GW4B2D(1)  
– Multiblock erase time (2 blocks): 1.5 ms  
(typ)  
NAND02G-B2D  
1. x 16 organization only available for MCP products.  
April 2008  
Rev 3  
1/69  
This is preliminary information on a new product now in development or undergoing evaluation. Details are subject to  
change without notice.  
www.numonyx.com  
1

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