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N08L63W2AB27IT PDF预览

N08L63W2AB27IT

更新时间: 2024-01-12 11:35:52
品牌 Logo 应用领域
安森美 - ONSEMI 存储内存集成电路静态存储器
页数 文件大小 规格书
10页 188K
描述
8Mb Ultra-Low Power Asynchronous CMOS SRAM 512K × 16 bit

N08L63W2AB27IT 技术参数

是否Rohs认证:符合生命周期:Obsolete
零件包装代码:BGA包装说明:TFBGA, BGA48,6X8,30
针数:48Reach Compliance Code:compliant
ECCN代码:3A991.B.2.AHTS代码:8542.32.00.41
风险等级:5.78Is Samacsys:N
最长访问时间:85 nsI/O 类型:COMMON
JESD-30 代码:R-PBGA-B48长度:10 mm
内存密度:8388608 bit内存集成电路类型:STANDARD SRAM
内存宽度:16功能数量:1
端子数量:48字数:524288 words
字数代码:512000工作模式:ASYNCHRONOUS
最高工作温度:85 °C最低工作温度:-40 °C
组织:512KX16输出特性:3-STATE
封装主体材料:PLASTIC/EPOXY封装代码:TFBGA
封装等效代码:BGA48,6X8,30封装形状:RECTANGULAR
封装形式:GRID ARRAY, THIN PROFILE, FINE PITCH并行/串行:PARALLEL
电源:2.5/3.3 V认证状态:Not Qualified
座面最大高度:1.2 mm最大待机电流:0.00001 A
最小待机电流:1.8 V子类别:SRAMs
最大压摆率:0.015 mA最大供电电压 (Vsup):3.6 V
最小供电电压 (Vsup):2.3 V标称供电电压 (Vsup):3 V
表面贴装:YES技术:CMOS
温度等级:INDUSTRIAL端子形式:BALL
端子节距:0.75 mm端子位置:BOTTOM
宽度:8 mmBase Number Matches:1

N08L63W2AB27IT 数据手册

 浏览型号N08L63W2AB27IT的Datasheet PDF文件第2页浏览型号N08L63W2AB27IT的Datasheet PDF文件第3页浏览型号N08L63W2AB27IT的Datasheet PDF文件第4页浏览型号N08L63W2AB27IT的Datasheet PDF文件第5页浏览型号N08L63W2AB27IT的Datasheet PDF文件第6页浏览型号N08L63W2AB27IT的Datasheet PDF文件第7页 
N08L63W2A  
8Mb Ultra-Low Power Asynchronous CMOS SRAM  
512K × 16 bit  
Overview  
Features  
The N08L63W2A is an integrated memory device  
containing a 8 Mbit Static Random Access Memory  
organized as 524,288 words by 16 bits. The device  
is designed and fabricated using ON  
• Single Wide Power Supply Range  
2.3 to 3.6 Volts  
• Very low standby current  
4.0µA at 3.0V (Typical)  
Semiconductor’s advanced CMOS technology to  
provide both high-speed performance and ultra-low  
power. The device operates with two chip enable  
(CE1 and CE2) controls and output enable (OE) to  
allow for easy memory expansion. Byte controls  
(UB and LB) allow the upper and lower bytes to be  
accessed independently and can also be used to  
deselect the device. The N08L63W2A is optimal  
for various applications where low-power is critical  
such as battery backup and hand-held devices.  
The device can operate over a very wide  
• Very low operating current  
2.0mA at 3.0V and 1µs(Typical)  
• Very low Page Mode operating current  
1.0mA at 3.0V and 1µs (Typical)  
• Simple memory control  
Dual Chip Enables (CE1 and CE2)  
Byte control for independent byte operation  
Output Enable (OE) for memory expansion  
• Low voltage data retention  
Vcc = 1.8V  
• Very fast output enable access time  
25ns OE access time  
o
o
temperature range of -40 C to +85 C and is  
available in JEDEC standard packages compatible  
with other standard 512Kb x 16 SRAMs  
• Very fast Page Mode access time  
t
= 25ns  
AAP  
• Automatic power down to standby mode  
• TTL compatible three-state output driver  
Product Family  
Standby  
Power  
Supply  
(Vcc)  
Operating  
Current (Icc),  
Typical  
Operating  
Current (ISB),  
Part Number  
Package Type  
Speed  
Temperature  
Typical  
N08L63W2AB  
N08L63W2AB2  
48 - BGA  
70ns@2.7V  
85ns @ 2.3V  
-40oC to +85oC  
2.3V - 3.6V  
4 µA  
2 mA @ 1MHz  
48 - BGA Green  
Pin Configuration  
Pin Descriptions  
1
2
3
A0  
A3  
4
5
A2  
6
Pin Name  
A0-A18  
WE  
CE1, CE2  
OE  
LB  
UB  
I/O0-I/O15  
Pin Function  
A1  
A4  
A6  
A7  
LB  
OE  
CE2  
A
B
C
D
E
F
Address Inputs  
Write Enable Input  
Chip Enable Input  
I/O8  
I/O0  
UB  
CE1  
I/O9 I/O10 A5  
VSS I/O11 A17  
I/O1 I/O2  
I/O3 VCC  
Output Enable Input  
Lower Byte Enable Input  
Upper Byte Enable Input  
Data Inputs/Outputs  
VCC I/O12  
I/O14 I/O13 A14  
A16 I/O4 VSS  
A15 I/O5 I/O6  
NC  
I/O15  
A18  
A12  
A9  
A13  
A10  
I/O7  
NC  
NC  
A8  
WE  
A11  
VCC  
VSS  
NC  
G
H
Power  
Ground  
Not Connected  
48 Pin BGA (top)  
8 x 10 mm  
©2008 SCILLC. All rights reserved.  
July 2008 - Rev. 8  
Publication Order Number:  
N08L63W2A/D  

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