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N04Q1625C2BB2-70I PDF预览

N04Q1625C2BB2-70I

更新时间: 2022-04-23 23:00:11
品牌 Logo 应用领域
NANOAMP 静态存储器
页数 文件大小 规格书
13页 300K
描述
4Mb Ultra-Low Power Asynchronous CMOS SRAM w/ Dual Vcc and VccQ for Ultimate Power Reduction 256K】16 bit POWER SAVER TECHNOLOGY

N04Q1625C2BB2-70I 数据手册

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NanoAmp Solutions, Inc.  
670 North McCarthy Blvd. Suite 220, Milpitas, CA 95035  
ph: 408-935-7777, FAX: 408-935-7770  
www.nanoamp.com  
N04Q16yyC2B  
Advance Information  
4Mb Ultra-Low Power Asynchronous CMOS SRAM w/ Dual  
Vcc and VccQ for Ultimate Power Reduction  
256K×16 bit POWER SAVER TECHNOLOGY  
Overview  
Features  
The N04Q16yyC2B are ultra-low power memory  
devices containing a 4 Mbit Static Random Access  
Memory organized as 262,144 words by 16 bits.  
The device is designed and fabricated using  
NanoAmp’s advanced CMOS technology to  
provide ultra-low active and standby power. The  
device operates with two chip enable (CE1 and  
CE2) controls and output enable (OE) to allow for  
easy memory expansion. Byte controls (UB and  
LB) allow the upper and lower bytes to be  
• Multiple Power Supply Ranges  
1.1V - 1.3V  
1.65V - 1.95V  
2.3V - 2.7V  
2.7V - 3.6V  
• Dual Vcc / VccQ Power Supplies  
1.2V Vcc with 3V VccQ  
1.8V Vcc with 3V VccQ  
2.5V Vcc with 3V VccQ  
• Very low standby current  
accessed independently. The 4Mb SRAM is  
optimized for the ultimate in low power and is  
suited for various applications where ultra-low-  
power is critical such as medical applications,  
battery backup and power sensitive hand-held  
devices. The unique page mode operation saves  
active operating power and the dual power supply  
rails allow very low voltage operation while  
maintaining 3V I/O capability. The device can  
50nA typical for 1.2V operation  
• Very low operating current  
400µA typical for 1.2V operation at 1µs  
• Very low Page Mode operating current  
80µA typical for 1.2V operation at 1µs  
• Simple memory control  
Dual Chip Enables (CE1 and CE2)  
Byte control for independent byte operation  
Output Enable (OE) for memory expansion  
o
operate over a very wide temperature range of 0 C  
o
to +70 C for the lowest power and is also available  
• Automatic power down to standby mode  
• BGA, TSOP and KGD options  
• RoHS Compliant  
o
o
in the industrial range of -40 C to +85 C. The  
devices are available in standard BGA and TSOP  
packages. The devices are also available as  
Known Good Die (KGD) for embedded package  
applications.  
Product Options  
Typical  
Vcc  
(V)  
VccQ  
(V)  
Speed  
(nS)  
Typical  
Operating  
Part Number  
I/O  
Standby  
Current  
Operating Current Temperature  
N04Q1612C2Bx-15C  
N04Q1618C2Bx-15C  
N04Q1618C2Bx-70C  
N04Q1625C2Bx-15C  
N04Q1630C2Bx-70C  
x16  
x16  
x16  
x16  
x16  
50nA  
50nA  
1.2  
1.8  
1.2, 1.8, 3 150ns  
0.4 mA @ 1MHz  
0.4 mA @ 1MHz  
150ns  
1.8, 2.5, 3  
0oC to +70oC  
200nA  
800nA  
800nA  
70ns  
0.6 mA @ 1MHz  
2.5  
3.0  
2.5, 3  
3.0  
150ns  
70ns  
0.6 mA @ 1MHz  
2.2mA @ 1MHz  
Stock No. 23451-B 2/06  
The specification is ADVANCE INFORMATION and subject to change without notice.  
1

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