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MXSMBG150A/TR13 PDF预览

MXSMBG150A/TR13

更新时间： 2024-11-27 04:17:35
品牌 Logo 应用领域
美高森美 - MICROSEMI 局域网光电二极管
页数 文件大小 规格书
4页 176K
描述
Trans Voltage Suppressor Diode, 600W, 150V V(RWM), Unidirectional, 1 Element, Silicon, DO-215AA, PLASTIC, SMBG, 2 PIN

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MXSMBG150A/TR13 技术参数

是否无铅： 含铅是否Rohs认证： 不符合
生命周期：Active零件包装代码：DO-215AA
包装说明：R-PDSO-G2针数：2
Reach Compliance Code：compliantECCN代码：EAR99
HTS代码：8541.10.00.50风险等级：5.23
最大击穿电压：185 V最小击穿电压：167 V
配置：SINGLE二极管元件材料：SILICON
二极管类型：TRANS VOLTAGE SUPPRESSOR DIODEJEDEC-95代码：DO-215AA
JESD-30 代码：R-PDSO-G2湿度敏感等级：1
最大非重复峰值反向功率耗散：600 W元件数量：1
端子数量：2最高工作温度：150 °C
最低工作温度：-65 °C封装主体材料：PLASTIC/EPOXY
封装形状：RECTANGULAR封装形式：SMALL OUTLINE
峰值回流温度（摄氏度）：NOT SPECIFIED极性：UNIDIRECTIONAL
最大功率耗散：1.38 W参考标准：MIL-19500
最大重复峰值反向电压：150 V表面贴装：YES
技术：AVALANCHE端子形式：GULL WING
端子位置：DUAL处于峰值回流温度下的最长时间：NOT SPECIFIED
Base Number Matches：1

MXSMBG150A/TR13 数据手册

 浏览型号MXSMBG150A/TR13的Datasheet PDF文件第2页浏览型号MXSMBG150A/TR13的Datasheet PDF文件第3页浏览型号MXSMBG150A/TR13的Datasheet PDF文件第4页 
SMBJ5.0 thru SMBJ170A, CA, e3  
and SMBG5.0 thru SMBG170A, CA, e3  
SURFACE MOUNT 600 Watt  
Transient Voltage Suppressor  
S C O T T S D A L E D I V I S I O N  
DESCRIPTION  
APPEARANCE  
This SMBJ5.0-170A or SMBG5.0-170A series of surface mount 600 W  
Transient Voltage Suppressors (TVSs) protects a variety of voltage-sensitive  
components from destruction or degradation. It is available in J-bend design  
(SMBJ) with the DO-214AA package for greater PC board mounting density or  
in a Gull-wing design (SMBG) in the DO-215AA for visible solder connections.  
It is also available in both unidirectional and bidirectional configurations with a  
C or CA suffix part number as well as RoHS Compliant with an e3 suffix. Their  
response time is virtually instantaneous. As a result, they can be used for  
protection from ESD or EFT per IEC61000-4-2 and IEC61000-4-4, or for  
inductive switching environments and induced RF protection. They can also  
protect from secondary lightning effects per IEC61000-4-5 and class levels  
defined herein. Microsemi also offers numerous other TVS products to meet  
NOTE: All SMB series are  
equivalent to prior SMS package  
identifications.  
higher and lower power demands and special applications.  
IMPORTANT: For the most current data, consult MICROSEMI’s website: http://www.microsemi.com  
FEATURES  
APPLICATIONS / BENEFITS  
• Available in both unidirectional and bidirectional  
•
•
Economical surface mount design in both J-bend or  
Gull-wing terminations  
construction (add C or CA suffix for bidirectional)  
• Selections for 5.0 to 170 volts standoff voltages (VWM  
)
Protects sensitive components such as IC’s, CMOS,  
Bipolar, BiCMOS, ECL, DTL, T2L, etc.  
• Optional 100% screening for avionics grade is available  
by adding MA prefix to part number for 100% temperature  
cycle -55oC to +125oC (10X) as well as surge (3X) and 24  
hours HTRB with post test VZ & IR (in operating direction  
for unidirectional or both directions for bidirectional)  
•
•
Protection from switching transients & induced RF  
Compliant to IEC61000-4-2 and IEC61000-4-4 for  
ESD and EFT protection respectively  
•
Secondary lightning protection per IEC61000-4-5 with  
42 Ohms source impedance:  
• Options for screening in accordance with MIL-PRF-19500  
for JANTX are available by adding MX prefix to the part  
number.  
Class 1: SMB 5.0 to SMB 120A or CA  
Class 2: SMB 5.0 to SMB 60A or CA  
Class 3: SMB 5.0 to SMB 30A or CA  
Class 4: SMB 5.0 to SMB 15A or CA  
• Axial-lead equivalent packages for thru-hole mounting  
available as P6KE6.8 to P6KE200CA (consult factory for  
other surface mount options)  
•
•
Secondary lightning protection per IEC61000-4-5 with  
12 Ohms source impedance:  
• Moisture classification is Level 1 with no dry pack required  
per IPC/JEDEC J-STD-020B  
Class 1: SMB 5.0 to SMB 36A or CA  
Class 2: SMB 5.0 to SMB 18A or CA  
• RoHS compliant devices available by adding an “e3” suffix  
•
MAXIMUM RATINGS  
• Peak Pulse Power dissipation at 25ºC: 600 watts at  
10/1000 μs (also see Fig 1,2, and 3).  
MECHANICAL AND PACKAGING  
•
CASE: Void-free transfer molded thermosetting  
epoxy body meeting UL94V-0  
• Impulse repetition rate (duty factor): 0.01%  
•
TERMINALS: Gull-wing or C-bend (modified J-bend)  
tin-lead or RoHS compliant annealed matte-tin plating  
solderable per MIL-STD-750, method 2026  
• tclamping (0 volts to V(BR) min.): < 100 ps theoretical for  
unidirectional and < 5 ns for bidirectional  
• Operating and Storage temperature: -65ºC to +150ºC  
•
•
•
POLARITY: Cathode indicated by band. No marking  
on bi-directional devices  
• Thermal resistance: 25 ºC/W junction to lead, or 90ºC/W  
junction to ambient when mounted on FR4 PC board (1oz  
Cu) with recommended footprint (see last page)  
MARKING: Part number without standard prefix (e.g.  
5.0, 5.0A, 5.0CA, 5.0Ae3, 36, MX36A, 36CAe3, etc.)  
• Steady-State Power dissipation: 5 watts at TL = 25oC, or  
1.38 watts at TA = 25ºC when mounted on FR4 PC board  
with recommended footprint  
TAPE & REEL option: Standard per EIA-481-1-A with  
12 mm tape, 750 per 7 inch reel or 2500 per 13 inch  
reel (add “TR” suffix to part number)  
•
•
WEIGHT: 0.1 grams  
• Forward Surge at 25ºC: 100 Amps peak impulse of 8.3  
See package dimension on last page  
ms half-sine wave (unidirectional only)  
• Solder temperatures: 260 ºC for 10 s (maximum)  
Copyright © 2009  
SA3-37, REV J, 5-24-2009  
Microsemi  
Page 1  
Scottsdale Division  
8700 E. Thomas Rd. PO Box 1390, Scottsdale, AZ 85252 USA, (480) 941-6300, Fax: (480) 947-1503  
1234

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