生命周期: | Active | 零件包装代码: | DIP |
包装说明: | DIP, | 针数: | 24 |
Reach Compliance Code: | compliant | ECCN代码: | 3A001.A.2.C |
HTS代码: | 8542.39.00.01 | 风险等级: | 5.59 |
转换器类型: | D/A CONVERTER | 输入位码: | BINARY, OFFSET BINARY, 2'S COMPLEMENT BINARY |
输入格式: | PARALLEL, WORD | JESD-30 代码: | R-GDIP-T24 |
最大线性误差 (EL): | 0.0122% | 位数: | 12 |
功能数量: | 2 | 端子数量: | 24 |
最高工作温度: | 125 °C | 最低工作温度: | -55 °C |
封装主体材料: | CERAMIC, GLASS-SEALED | 封装代码: | DIP |
封装形状: | RECTANGULAR | 封装形式: | IN-LINE |
认证状态: | Not Qualified | 筛选级别: | MIL-STD-883 |
座面最大高度: | 5.08 mm | 标称安定时间 (tstl): | 0.08 µs |
表面贴装: | NO | 技术: | CMOS |
温度等级: | MILITARY | 端子形式: | THROUGH-HOLE |
端子节距: | 2.54 mm | 端子位置: | DUAL |
宽度: | 7.62 mm | Base Number Matches: | 1 |
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