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MX7547SQ/883B PDF预览

MX7547SQ/883B

更新时间: 2024-11-28 21:08:55
品牌 Logo 应用领域
美信 - MAXIM 转换器
页数 文件大小 规格书
5页 35K
描述
D/A Converter, 1 Func, Parallel, Word Input Loading, CDIP24, CERAMIC, DIP-24

MX7547SQ/883B 技术参数

是否无铅: 含铅是否Rohs认证: 不符合
生命周期:Obsolete零件包装代码:DIP
包装说明:CERAMIC, DIP-24针数:24
Reach Compliance Code:not_compliantECCN代码:3A001.A.2.C
HTS代码:8542.39.00.01风险等级:5.63
转换器类型:D/A CONVERTER输入位码:BINARY
输入格式:PARALLEL, WORDJESD-30 代码:R-GDIP-T24
最大线性误差 (EL):0.0244%湿度敏感等级:1
位数:12功能数量:1
端子数量:24最高工作温度:125 °C
最低工作温度:-55 °C封装主体材料:CERAMIC, GLASS-SEALED
封装代码:DIP封装形状:RECTANGULAR
封装形式:IN-LINE峰值回流温度(摄氏度):225
筛选级别:MIL-STD-883 Class B标称供电电压:15 V
表面贴装:NO技术:CMOS
温度等级:MILITARY端子形式:THROUGH-HOLE
端子位置:DUAL处于峰值回流温度下的最长时间:NOT SPECIFIED
Base Number Matches:1

MX7547SQ/883B 数据手册

 浏览型号MX7547SQ/883B的Datasheet PDF文件第2页浏览型号MX7547SQ/883B的Datasheet PDF文件第3页浏览型号MX7547SQ/883B的Datasheet PDF文件第4页浏览型号MX7547SQ/883B的Datasheet PDF文件第5页 
SCOPE: CMOS, PARALLEL-LOADING, DUAL, MULTIPLYING 12-BIT D/A CONVERTER  
Device Type  
Generic Number  
MX7537U(x)/883B  
MX7537T(x)/883B  
MX7537S(x)/883B  
MX7547U(x)/883B  
MX7547T(x)/883B  
MX7547S(x)/883B  
01  
02  
03  
04  
05  
06  
Case Outline(s). The case outlines shall be designated in Mil-Std-1835 and as follows:  
Outline Letter  
Mil-Std-1835  
Case Outline  
Package Code  
MAXIM SMD  
Q
E
L
3
GDIP1-T24 or CDIP2-T24  
CQCC1-N28  
24 LEAD CERDIP  
28 LEADLESS CHIP L28  
J24  
Absolute Maximum Ratings:  
VDD to DGND ........................................................................................………. -0.3V, + 17V  
VRFBA, VRFBB to AGND .......................................................................................………. ±25V  
VREFA, VREFB to AGND .......................................................................................………. ±25V  
Digital Input Voltage to DGND .....................................................……… -0.3V, (VDD+0.3V)  
IOUTA, IOUTB Voltage to DGND ...............................................…….... -0.3V, (VDD+0.3V)  
AGND to DGND ............................................................................…….... -0.3V, (VDD+0.3V)  
Lead Temperature (soldering, 10 seconds) ........................................................................ +300°C  
Storage Temperature ........................................................................................... -65°C to +150°C  
Continuous Power Dissipation ..........................................................................……... TA=+70°C  
24 pin CERDIP(derate 12.5mW/°C above +70°C) ...............................................…….. 1000mW  
28 pin LCC(derate 10.2mW/°C above +70°C) .......................................................…….. 816mW  
Junction Temperature TJ .....................................................................................…….... +150°C  
Thermal Resistance, Junction to Case, ΘJC  
24 pin CERDIP................................................................................................…….... 40°C/W  
28 pin LCC .....................................................................................................……..... 15°C/W  
Thermal Resistance, Junction to Ambient, ΘJA:  
24 pin CERDIP................................................................................................…….... 80°C/W  
28 pin LCC .....................................................................................................………. 98°C/W  
Recommended Operating Conditions  
Ambient Operating Range (TA) ............................................................……... -55°C to +125°C  
Logic Supply Voltage (VLOGIC) ................................................................……... +4.5V to +5.5V  
Positive Supply Voltage (VDD)..............................................................……... +11.4V to +16.5V  
Negative Supply Voltage (VEE)...............................................................……... -11.4V to -16.5V  
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device.  
These are stress ratings only, and functional operation of the device at these or any other conditions beyond  
those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum  
rating conditions for extended periods may affect device reliability.  
----------------------- Electrical Characteristics of MX7537/47/883B for /883B  
and SMD 5962-87763 and SMD 5962-89657  
19-0057  
Page 2 of  
Rev. C  
7

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