MURP20020CT,
MURP20040CT
Preferred Devices
POWERTAPt II Ultrafast
SWITCHMODEt Power
Rectifiers
These state−of−the−art POWERTAP II Ultrafast SWITCHMODE
power rectifiers are designed for use in switching power supplies,
inverters, and as free wheeling diodes.
http://onsemi.com
ULTRAFAST RECTIFIERS
200 AMPERES, 200−400 VOLTS
Features
• Dual Diode Construction
• Low Leakage Current
• Low Forward Voltage
1
3
• 175°C Operating Junction Temperature
• Labor Saving POWERTAP Package
• Pb−Free Packages are Available*
2
Mechanical Characteristics:
2
• Case: Epoxy, Molded with Metal Heatsink Base
• Weight: 80 Grams (Approximately)
1
• Finish: All External Surfaces Corrosion Resistant
• Top Terminal Torque: 25 − 40 lb−in Max
POWERTAP II
CASE 357C
PLASTIC
3
• Base Plate Torques: See Procedure Given in the Package Outline
Section
MAXIMUM RATINGS
MARKING DIAGRAM
Rating
Symbol
Value
Unit
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
V
V
RRM
RWM
R
V
DC Blocking Voltage
MURP20020CT
MURP20040CT
V
300
400
AYYWWG
UP200x0
Average Rectified Forward Current
I
A
A
A
F(AV)
@ T = 150°C − Per Device
200
100
L
@ T = 125°C − Per Leg
L
A
= Assembly Location
= Year
= Work Week
YY
WW
G
Peak Repetitive Surge Current Per Leg
(Surge applied at rated load conditions
halfwave, single phase, 60 Hz)
I
200
FRM
= Pb−Free Package
UP200x0 = Device Code
x = 2 or 4
Nonrepetitive Peak Surge Current Per Leg
(Surge applied at rated load conditions
halfwave, single phase, 60 Hz)
I
FSM
800
ORDERING INFORMATION
Operating Junction Temperature
Storage Temperature
T
−55 to +175
−55 to +150
°C
°C
J
T
stg
Device
MURP20020CT
Package
Shipping
THERMAL CHARACTERISTICS
Rating
POWERTAP II 25 Units/Tray
Symbol
Max
Unit
MURP20020CTG POWERTAP II 25 Units/Tray
(Pb−Free)
Thermal Resistance, Junction−to−Lead
R
q
JC
0.45
°C/W
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
MURP20040CT
POWERTAP II 25 Units/Tray
MURP20040CTG POWERTAP II 25 Units/Tray
(Pb−Free)
*For additional information on our Pb−Free strategy and soldering details, please
download the ON Semiconductor Soldering and Mounting Techniques
Reference Manual, SOLDERRM/D.
Preferred devices are recommended choices for future use
and best overall value.
©
Semiconductor Components Industries, LLC, 2006
1
Publication Order Number:
September, 2006 − Rev. 6
MURP20020CT/D