MUR450PF
Preferred Device
SWITCHMODEt
Power Rectifier
These state−of−the−art devices are designed for power factor
correction in discontinuous and critical conduction mode.
Features
http://onsemi.com
• 520 V Rating Meets 80% Derating Requirements of Major OEMs
• Low Forward Voltage Drop
• Low Leakage
• Ultrafast 95 Nanosecond Recovery Time
• Reduces Forward Conduction Loss
• These are Pb−Free Devices*
ULTRAFAST RECTIFIER
4.0 AMPERES, 520 VOLTS
Applications
• DCM PFC Designs
• Switching Power Supplies
• Power Inverters
Mechanical Characteristics:
AXIAL LEAD
CASE 267
STYLE 1
• Case: Epoxy, Molded
• Epoxy Meets UL 94 V−0 @ 0.125 in
• Weight: 1.1 Gram (Approximately)
• Finish: All External Surfaces Corrosion Resistant and Terminal
MARKING DIAGRAM
Leads are Readily Solderable
• Lead Temperature for Soldering Purposes:
260°C Max. for 10 Seconds
A
MUR
450
MAXIMUM RATINGS
YYWWG
Rating
Symbol
Value
Unit
G
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
V
520
V
RRM
V
RWM
A
= Assembly Location
V
R
MUR450 = Device Number
Average Rectified Forward Current
I
4.0
85
A
A
F(AV)
YY
WW
G
= Year
= Work Week
= Pb−Free Package
(Rated V , T = 65°C)
R
C
Non−Repetitive Peak Surge Current
(Surge Applied at Rated Load Conditions
Halfwave, 60 Hz)
I
FSM
(Note: Microdot may be in either location)
ORDERING INFORMATION
Operating Junction Temperature Range
Storage Temperature Range
T
−65 to +175
−65 to +175
°C
°C
V
J
†
T
stg
Device
Package
Shipping
ESD Ratings:
Machine Model = C
Human Body Model = 3B
ESD
> 400
> 8000
MUR450PF
Axial Lead**
Axial Lead**
500 Units/Bag
500 Units/Bag
MUR450PFG
THERMAL CHARACTERISTICS
Rating
MUR450PFRL
Axial Lead** 1500/Tape & Reel
Symbol
Value
Unit
MUR450PFRLG Axial Lead** 1500/Tape & Reel
Thermal Resistance, Junction−to−Ambient
R
q
JA
See Note 2 °C/W
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
**This package is inherently Pb−Free.
*For additional information on our Pb−Free strategy and soldering details, please
download the ON Semiconductor Soldering and Mounting Techniques
Reference Manual, SOLDERRM/D.
Preferred devices are recommended choices for future use
and best overall value.
©
Semiconductor Components Industries, LLC, 2006
1
Publication Order Number:
July, 2006 − Rev. 2
MUR450PF/D