LESHAN RADIO COMPANY, LTD.
Bias Resistor Transistor
NPN Silicon Surface Mount Transistor with
MUN2211RT1
MUN2212RT1
MUN2213RT1
Monolithic Bias Resistor Network
This new series of digital transistors is designed to replace a single device and its
external resistor bias network. The BRT (Bias Resistor Transistor) contains a single
transistor with a monolithic bias network consisting of two resistors; a series base
resistor and a base–emitter resistor. The BRT eliminates these individual components by
integrating them into a single device. The use of a BRT can reduce both system cost and
board space. The device is housed in the SC–59 package which is designed for low
power surface mount applications.
MUN2214RT1
MUN2215RT1
MUN2216RT1
MUN2230RT1
MUN2231RT1
MUN2232RT1
MUN2233RT1
MUN2234RT1
• Simplifies Circuit Design
• Reduces Board Space
• Reduces Component Count
• The SC–59 package can be soldered using wave or reflow.
The modified gull–winged leads absorb thermal stress during
soldering eliminating the possibility of damage to the die.
• Available in 8 mm embossed tape and reel
NPN SILICON
BIAS RESISTOR
TRANSISTOR
Use the Device Number to order the 7 inch/3000 unit reel.
3
PIN3
Collector
PIN2
base
R1
(Output)
2
(Input)
R2
1
PIN2
Emitter
(Ground)
CASE 318–03 , STYLE 1
( SC – 59 )
MAXIMUM RATINGS (T A = 25°C unless otherwise noted)
Rating
Symbol
VCBO
V CEO
IC
Value
Unit
Vdc
Collector-Base Voltage
50
50
Collector-Emitter Voltage
Vdc
Collector Current
Total Power Dissipation @ T A = 25°C (1)
100
200
1.6
mAdc
mW
P D
Derate above 25°C
mW/°C
THERMALCHARACTERISTICS
Rating
Symbol
R θ JA
Value
625
Unit
°C/W
°C
Thermal Resistance — Junction-to-Ambient (surface mounted)
Operating and Storage Temperature Range
Maximum Temperature for Soldering Purposes
Time in Solder Bath
T J , T stg
–65 to +150
260
°C
T L
10
Sec
DEVICE MARKING AND RESISTOR VALUES
Device
Marking
8A
8B
R1 (K)
10
22
47
10
R2 (K)
MUN2211RT1
MUN2212RT1
MUN2213RT1
MUN2214RT1
MUN2215RT1(2)
MUN2216RT1(2)
MUN2230RT1(2)
MUN2231RT1(2)
MUN2232RT1(2)
MUN2233RT1(2)
MUN2234RT1(2)
10
22
47
47
8C
8D
8E
8F
8G
8H
8J
8K
8L
10
4.7
1.0
2.2
4.7
4.7
22
1.0
2.2
4.7
47
47
1. Device mounted on a FR-4 glass epoxy printed circuit board using the minimum recommended footprint.
2. New devices. Updated curves to follow in subsequent data sheets.
P2–1/8