LESHAN RADIO COMPANY, LTD.
Bias Resistor Transistor
PNP Silicon Surface Mount Transistor with
Monolithic Bias Resistor Network
This new series of digital transistors is designed to replace a single device and
its external resistor bias network. The BRT (Bias Resistor Transistor) contains a
single transistor with a monolithic bias network consisting of two resistors; a series
base resistor and a base–emitter resistor. The BRT eliminates these individual
components by integrating them into a single device. The use of a BRT can reduce
both system cost and board space. The device is housed in the SC–59 package
which is designed for low power surface mount applications.
• Simplifies Circuit Design
MUN2111RT1
MUN2112RT1
MUN2113RT1
MUN2114RT1
MUN2115RT1
MUN2116RT1
MUN2130RT1
MUN2131RT1
MUN2132RT1
MUN2133RT1
MUN2134RT1
• Reduces Board Space
• Reduces Component Count
• The SC–59 package can be soldered using wave or reflow.
The modified gull–winged leads absorb thermal stress during
soldering eliminating the possibility of damage to the die.
• Available in 8 mm embossed tape and reel
PNP SILICON
BIAS RESISTOR
TRANSISTOR
Use the Device Number to order the 7 inch/3000 unit reel.
3
PIN3
Collector
PIN2
base
R1
(Output)
2
(Input)
R2
1
PIN2
Emitter
(Ground)
CASE 318–03 , STYLE 1
( SC – 59 )
MAXIMUM RATINGS (T A = 25°C unless otherwise noted)
Rating
Symbol
VCBO
V CEO
IC
Value
Unit
Vdc
Collector-Base Voltage
50
50
Collector-Emitter Voltage
Vdc
Collector Current
Total Power Dissipation @ T A = 25°C (1)
100
200
1.6
mAdc
mW
P D
Derate above 25°C
mW/°C
THERMALCHARACTERISTICS
Rating
Symbol
R θ JA
Value
625
Unit
°C/W
°C
Thermal Resistance — Junction-to-Ambient (surface mounted)
Operating and Storage Temperature Range
Maximum Temperature for Soldering Purposes
Time in Solder Bath
T J , T stg
–65 to +150
260
°C
T L
10
Sec
DEVICE MARKING AND RESISTOR VALUES
Device
Marking
6A
6B
R1 (K)
10
22
47
10
R2 (K)
MUN2111RT1
MUN2112RT1
MUN2113RT1
MUN2114RT1
MUN2115RT1(2)
MUN2116RT1(2)
MUN2130RT1(2)
MUN2131RT1(2)
MUN2132RT1(2)
MUN2133RT1(2)
MUN2134R T1(2)
10
22
47
47
6C
6D
6E
6F
6G
6H
6J
6K
6L
10
4.7
1.0
2.2
4.7
4.7
22
1.0
2.2
4.7
47
47
1. Device mounted on a FR-4 glass epoxy printed circuit board using the minimum recommended footprint.
2. New devices. Updated curves to follow in subsequent data sheets.
P1–1/7