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MTP3N50EAJ

更新时间: 2024-02-26 06:03:20
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摩托罗拉 - MOTOROLA 晶体晶体管功率场效应晶体管开关脉冲局域网
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MTP3N50EAJ 数据手册

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Order this document  
by MTP3N50E/D  
SEMICONDUCTOR TECHNICAL DATA  
Motorola Preferred Device  
N–Channel Enhancement–Mode Silicon Gate  
TMOS POWER FET  
3.0 AMPERES  
500 VOLTS  
This advanced high voltage TMOS E–FET is designed to  
withstand high energy in the avalanche mode and switch efficiently.  
This new high energy device also offers a drain–to–source diode  
with fast recovery time. Designed for high voltage, high speed  
switching applications such as power supplies, PWM motor  
controls and other inductive loads, the avalanche energy capability  
is specified to eliminate the guesswork in designs where inductive  
loads are switched and offer additional safety margin against  
unexpected voltage transients.  
R
= 3.0 OHMS  
DS(on)  
D
Avalanche Energy Capability Specified at Elevated  
Temperature  
Low Stored Gate Charge for Efficient Switching  
Internal Source–to–Drain Diode Designed to Replace External  
Zener Transient Suppressor — Absorbs High Energy in the  
Avalanche Mode  
G
S
Source–to–Drain Diode Recovery Time Comparable to Discrete  
Fast Recovery Diode  
CASE 221A–06, Style 5  
TO–220AB  
MAXIMUM RATINGS (T = 25°C unless otherwise noted)  
C
Rating  
Symbol  
Value  
500  
Unit  
Vdc  
Vdc  
Drain–Source Voltage  
V
DSS  
Drain–Gate Voltage (R  
= 1.0 M)  
Gate–Source Voltage — Continuous  
V
DGR  
500  
GS  
V
±20  
±40  
Vdc  
Vpk  
GS  
Gate–Source Voltage — Non–repetitive (t 50 µs)  
V
GSM  
p
Drain Current — Continuous  
Drain Current — Pulsed  
I
3.0  
10  
Adc  
D
I
DM  
Total Power Dissipation @ T = 25°C  
Derate above 25°C  
P
D
50  
0.4  
Watts  
W/°C  
C
Operating and Storage Temperature Range  
T , T  
65 to 150  
°C  
J
stg  
UNCLAMPED DRAIN–TO–SOURCE AVALANCHE CHARACTERISTICS (T < 150°C)  
J
Single Pulse Drain–to–Source Avalanche Energy — T = 25°C  
W
W
(1)  
(2)  
210  
33  
5.0  
mJ  
J
DSR  
Single Pulse Drain–to–Source Avalanche Energy — T = 100°C  
J
Repetitive Pulse Drain–to–Source Avalanche Energy  
DSR  
THERMAL CHARACTERISTICS  
Thermal Resistance — Junction to Case°  
— Junction to Ambient°  
R
R
2.5  
62.5  
°C/W  
°C  
θJC  
θJA  
Maximum Lead Temperature for Soldering Purposes, 1/8from case for 10 seconds  
T
260  
L
(1) V  
DD  
= 50 V, I = 3.0 A  
D
(2) Pulse Width and frequency is limited by T (max) and thermal response  
J
Designer’s Data for “Worst Case” Conditions — The Designer’s Data Sheet permits the design of most circuits entirely from the information presented. SOA Limit  
curves — representing boundaries on device characteristics — are given to facilitate “worst case” design.  
E–FET and Designer’s are trademarks of Motorola, Inc. TMOS is a registered trademark of Motorola, Inc.  
Preferred devices are Motorola recommended choices for future use and best overall value.  
REV 1  
Motorola, Inc. 1996  

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