Datasheet > MTC40F204WS1RC56B

MTC40F204WS1RC56B

更新时间： 2024-03-03 10:07:50

品牌	Logo	应用领域
镁光 - MICRON		/
页数	文件大小	规格书
8页	281K
描述
This technical note describes shipping procedures for preventing memory devices from absorbing moisture and recommendations for baking devices exposed to excessive moisture.

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MTC40F204WS1RC56B 数据手册

TN-00-01: Moisture Absorption

Introduction

Technical Note

Moisture Sensitivity of Plastic Packages

Introduction

All plastic integrated-circuit packages tend to absorb moisture. During surface-mount

assembly, this moisture can vaporize when subjected to the heat associated with solder

reflow operations. Vaporization creates internal stresses that can cause the plastic

molding compound to crack. This cracking process is commonly referred to as the

“popcorn effect.”

Cracks in the plastic molding may cause broken bond wires or may allow contamination

to penetrate to the die, which can reduce the reliability of the semiconductor device.

Since plastic packages absorb moisture, care must be taken to prevent exposure to

humid conditions greater than 10% RH for extended periods of time prior to surface-

mount reflow processing. If exposed to excessive moisture, the devices should be baked

to remove moisture prior to solder reflow operations.

This technical note describes the shipping procedures that can ensure Micron

customers receive memory devices that do not exhibit the popcorn effect. It also

discusses Micron’s recommendations for baking the devices if they are exposed to exces-

sive moisture.

Standards referenced in this discussion are available for download at the JEDEC Web site

at www.jedec.org.

PDF: CCMTD-1725822587-6205/Source: CCM005-524338224-10529

TN0001.fm - Rev. J 8/23 EN

Micron Technology, Inc., reserves the right to change products or specifications without notice.

Products and specifications discussed herein are for evaluation and reference purposes only and are subject to change by

Micron without notice. Products are only warranted by Micron to meet Micron’s production data sheet specifications. All

information discussed herein is provided on an “as is” basis, without warranties of any kind.

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