TN-00-01: Moisture Absorption
Introduction
Technical Note
Moisture Sensitivity of Plastic Packages
Introduction
All plastic integrated-circuit packages tend to absorb moisture. During surface-mount
assembly, this moisture can vaporize when subjected to the heat associated with solder
reflow operations. Vaporization creates internal stresses that can cause the plastic
molding compound to crack. This cracking process is commonly referred to as the
“popcorn effect.”
Cracks in the plastic molding may cause broken bond wires or may allow contamination
to penetrate to the die, which can reduce the reliability of the semiconductor device.
Since plastic packages absorb moisture, care must be taken to prevent exposure to
humid conditions greater than 10% RH for extended periods of time prior to surface-
mount reflow processing. If exposed to excessive moisture, the devices should be baked
to remove moisture prior to solder reflow operations.
This technical note describes the shipping procedures that can ensure Micron
customers receive memory devices that do not exhibit the popcorn effect. It also
discusses Micron’s recommendations for baking the devices if they are exposed to exces-
sive moisture.
Standards referenced in this discussion are available for download at the JEDEC Web site
at www.jedec.org.
PDF: CCMTD-1725822587-6205/Source: CCM005-524338224-10529
TN0001.fm - Rev. J 8/23 EN
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