8GB (x72, ECC, SR) 288-Pin DDR4 MiniRDIMM
Features
DDR4 SDRAM MiniRDIMM
MTA9ASF1G72PKIZ – 8GB
Figure 1: 288-Pin MiniRDIMM (MO-314, R/C-ZZ)
Features
• DDR4 functionality and operations supported as
defined in the component data sheet
Module Height: 30mm (1.181 in)
• 288-pin, registered dual in-line mini memory
module (MiniRDIMM)
• Fast data transfer rates: PC4-3200, PC4-2666
• 8GB (1 Gig x 72)
• VDD = 1.20V (NOM)
• VPP = 2.5V (NOM)
• VDDSPD = 2.5V (NOM)
Options
• Operating temperature
– Industrial (–40°C ≤ TOPER ≤ +95°C)
• Package
Marking
• Supports ECC error detection and correction
• Nominal and dynamic on-die termination (ODT) for
data, strobe, and mask signals
I
– 288-pin DIMM (halogen-free)
• Frequency/CAS latency
– 0.62ns @ CL = 22 (DDR4-3200)
– 0.75ns @ CL = 19 (DDR4-2666)
Z
• Low-power auto self refresh (LPASR)
• Data bus inversion (DBI) for data bus
• On-die VREFDQ generation and calibration
• Single-rank
-3G2
-2G6
• On-board I2C temperature sensor with integrated
serial presence-detect (SPD) EEPROM
• 16 internal banks; 4 groups of 4 banks each
• Fixed burst chop (BC) of 4 and burst length (BL) of 8
via the mode register set (MRS)
• Selectable BC4 or BL8 on-the-fly (OTF)
• Gold edge contacts
• Halogen-free
• Fly-by topology
• Terminated control, command, and address bus
Table 1: Key Timing Parameters
Data Rate (MT/s)
CL =
22/
21
tRCD tRP tRC
(ns) (ns) (ns)
PC4- 24
20
19
18
17
16
15
14
13
12
11
10
9
-3G2 3200 3200 3200/ 2666 2666 2400 2400 2133 2133 1866 1866 1600 1600 1333
–
–
13.75 13.75 45.75
-2G9 2933
–
2933/ 2666 2666 2400 2400 2133 2133 1866 1866 1600 1600 1333
2933
–
14.32 14.32 46.32
-2G6 2666
-2G3 2400
–
–
–
–
2666 2666 2400 2400 2133 2133 1866 1866 1600 1600 1333
2400 2400 2133 2133 1866 1866 1600 1600 1333
–
–
14.16 14.16 46.16
14.16 14.16 46.16
–
–
CCMTD-341111752-10427
asf9c1gx72pkiz.pdf - Rev. D 1/18 EN
Micron Technology, Inc. reserves the right to change products or specifications without notice.
1
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Products and specifications discussed herein are subject to change by Micron without notice.