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MT8VDDT3264AG-40BC4 PDF预览

MT8VDDT3264AG-40BC4

更新时间: 2024-02-18 11:04:04
品牌 Logo 应用领域
镁光 - MICRON 动态存储器双倍数据速率
页数 文件大小 规格书
15页 356K
描述
256MB, 512MB (x64, SR) 184-Pin DDR SDRAM UDIMM

MT8VDDT3264AG-40BC4 数据手册

 浏览型号MT8VDDT3264AG-40BC4的Datasheet PDF文件第2页浏览型号MT8VDDT3264AG-40BC4的Datasheet PDF文件第3页浏览型号MT8VDDT3264AG-40BC4的Datasheet PDF文件第4页浏览型号MT8VDDT3264AG-40BC4的Datasheet PDF文件第5页浏览型号MT8VDDT3264AG-40BC4的Datasheet PDF文件第6页浏览型号MT8VDDT3264AG-40BC4的Datasheet PDF文件第7页 
256MB, 512MB (x64, SR) 184-Pin DDR SDRAM UDIMM  
Fe a t u re s  
DDR SDRAM UDIMM  
MT8VDDT3264A – 256MB  
MT8VDDT6464A – 512MB  
For component data sheets, refer to Microns Web site: www.micron.com  
Fe a t u re s  
Fig u re 2:  
Alt e rn a t ive La yo u t  
• 184-pin, unbuffered dual in-line memory module  
(UDIMM)  
PCB height: 31.75mm (1.25in)  
• Fast data transfer rates: PC2100, PC2700, or PC3200  
• 256MB (32 Meg x 64), and 512MB (64 Meg x 64)  
• VDD = VDDQ = +2.5V (-40B: VDD = VDDQ)  
• VDDSPD = +2.3V to +3.6V  
• 2.5V I/ O (SSTL_2-compatible)  
• Internal pipelined double data rate (DDR)  
2n-prefetch architecture  
Fig u re 3:  
Re d u ce d -He ig h t La yo u t  
• Bidirectional data strobe (DQS) transmitted/  
received with data—that is, source-synchronous  
data capture  
PCB height: 28.58mm (1.125in)  
• Differential clock inputs (CK and CK#)  
• Multiple internal device banks for concurrent  
operation  
• Single rank  
• Selectable burst lengths (BL): 2, 4, or 8  
Auto precharge option  
Op t io n s  
Ma rkin g  
Auto refresh and self refresh modes: 7.8125µs  
maximum average periodic refresh interval  
• Serial presence-detect (SPD) with EEPROM  
• Selectable CAS latency (CL) for maximum  
compatibility  
1
• Operating temperature  
Commercial (0°C T +70°C)  
Industrial (–40°C T +85°C)  
• Package  
184-pin DIMM (standard)  
184-pin DIMM (Pb-free)  
None  
I
A
A
G
Y
• Gold edge contacts  
• Memory clock, speed, CAS latency  
5.0ns (200 MHz), 400 MT/ s, CL = 3  
6.0ns (167 MHz), 333 MT/ s, CL = 2.5  
184-Pin UDIMM (MO-206) Fig u re s  
-40B  
-335  
-262  
-26A  
-265  
Fig u re 1:  
St a n d a rd La yo u t  
2
7.5ns (133 MHz), 266 MT/ s, CL = 2  
7.5ns (133 MHz), 266 MT/ s, CL = 2  
2
PCB height: 31.75mm (1.25in)  
2
7.5ns (133 MHz), 266 MT/ s, CL = 2.5  
Notes: 1. Contact Micron for industrial temperature  
module offerings.  
2. Not recommended for new designs.  
PDF: 09005aef80867ab3/Source: 09005aef80867a99  
DD8C32_64x64A.fm - Rev. J 8/08 EN  
Micron Technology, Inc., reserves the right to change products or specifications without notice.  
©2003 Micron Technology, Inc. All rights reserved.  
1
Products and specifications discussed herein are subject to change by Micron without notice.  

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