SRAM
MT5C1008
128K x 8 SRAM
WITH DUAL CHIP ENABLE
PIN ASSIGNMENT
(Top View)
AVAILABLE AS MILITARY
SPECIFICATIONS
•SMD 5962-89598
•MIL-STD-883
32-Pin DIP (C, CW)
32-Pin CSOJ (SOJ)
32-Pin LCC (EC)
32-Pin SOJ (DCJ)
VCC
NC
A16
A14
A12
A7
A6
A5
A4
A3
A2 10
A1 11
A0 12
DQ1 13
DQ2 14
DQ3 15
1
2
3
4
5
6
7
8
9
32
VCC
NC
A16
A14
A12
A7
A6
A5
A4
A3
A2
A1
A0
DQ1
DQ2
DQ3
VSS
1
2
3
4
5
6
7
8
32
31
30
29
28
27
26
25
24
23
22
21
20
19
18
17
31 A15
30 CE2
29 WE\
28 A13
27 A8
A15
CE2
WE\
A13
A8
FEATURES
• High Speed: 12, 15, 20, 25, 35, 45, 55, 70, 85,
100 and 120 ns
• Battery Backup: 2V data retention
• Low power standby
• High-performance, low-power CMOS process
• Single +5V (+10%) Power Supply
• Easy memory expansion with CE1\, CE2, and OE\
options.
A9
26 A9
A11
OE\
A10
CE\
DQ8
DQ7
DQ6
DQ5
DQ4
25 A11
24 OE\
23 A10
22 CE\
21 DQ8
20 DQ7
19 DQ6
18 DQ5
17 DQ4
9
10
11
12
13
14
15
16
VSS
16
32-Pin LCC (ECA)
32-Pin Flat Pack (F)
• All inputs and outputs are TTL compatible
• Micross Components uses die type Cy7C109B from
Cypress -6-T SRAM cell design
4
3 2 1 32 31 30
NC
A16
A14
A12
A7
A6
A5
A4
A3
A2 10
A1 11
A0 12
DQ1 13
DQ2 14
DQ3 15
VSS 16
1
2
3
4
5
6
7
8
9
32 VCC
31 A15
30 CE2
29 WE\
28 A13
27 A8
5
6
7
8
9
10
11
12
13
A7
A6
A5
A4
A3
A2
A1
A0
DQ1
29
28
27
26
25
24
23
22
21
WE
\
A13
A8
A9
26 A9
25 A11
24 OE\
23 A10
22 CE\
21 DQ8
20 DQ7
19 DQ6
18 DQ5
17 DQ4
A11
OE
\
A10
CE1
DQ8
\
OPTIONS
• Timing
MARKING
14 15 16 17 18 19 20
12ns access
15ns access
20ns access
25ns access
35ns access
45ns access
55ns access
70ns access
85ns access
100ns access
120ns access
-12 (contact factory)
-15
-20
-25
-35
-45
-55*
-70*
-85*
-100*
-120*
GENERAL DESCRIPTION
The MT5C1008 SRAM employs high-speed, low
power CMOS designs using a four-transistor memory cell, and
are fabricated using double-layer metal, double-layer polysili-
con technology.
For design flexibility in high-speed memory appli-
cations, this device offers dual chip enables (CE1\, CE2) and
output enable (OE\). These control pins can place the outputs
in High-Z for additional flexibility in system design. All de-
vices operate from a single +5V power supply and all inputs
and outputs are fully TTL compatible.
Writing to these devices is accomplished when write
enable (WE\) and CE1\ inputs are both LOW and CE2 is HIGH.
Reading is accomplished when WE\ and CE2 remain HIGH
and CE1\ and OE\ go LOW. The devices offer a reduced
power standby mode when disabled, allowing system designs
to achieve low standby power requirements.
• Package(s)•
Ceramic DIP (400 mil)
Ceramic DIP (600 mil)
Ceramic LCC
Ceramic LCC
Ceramic Flatpack
Ceramic SOJ
C
No. 111
No. 112
No. 207
No. 208
No. 303
No. 501
No. 507
CW
EC
ECA
F
DCJ
SOJ
Ceramic SOJ
The “L” version offers a 2V data retention mode,
reducing current consumption to 1mA maximum.
• 2V data retention/low power
L
For more products and information
please visit our web site at
www.micross.com
Micross Components reserves the right to change products or specifications without notice.
MT5C1008
Rev. 6.9 06/11
1