MT5C1005 883C
256K x 4 SRAM
AUSTIN SEMICONDUCTOR, INC.
SRAM
256K x 4 SRAM
AVAILABLE AS MILITARY
SPECIFICATIONS
PIN ASSIGNMENT (Top View)
•
MIL-STD-883
28-Pin DIP
(400 MIL)
32-Pin LCC
32-Pin SOJ
FEATURES
•
•
•
•
High speed: 15, 20, 25, 35 and 45ns
Battery Backup: 2V data retention
Low power standby
High-performance, low-power, CMOS double-metal
process
A7
A8
A9
1
32
31
30
29
28
27
26
25
24
23
22
21
20
19
18
17
Vcc
A6
A5
A2
A4
A7
A8
A9
A10
A11
A12
A13
A14
A15
1
2
3
4
5
6
7
8
9
28 Vcc
27 A6
26 A5
25 A4
24 A3
23 A2
22 A1
21 A0
20 NC
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
A12
A10
A11
A13
NC
A14
A15
A16
A17
NC
CE
•
•
•
Single +5V (±10%) power supply
Easy memory expansion with CE and OE options
All inputs and outputs are TTL compatible
A3
A1
NC
NC
A0
NC
DQ4
DQ3
DQ2
DQ1
WE
OPTIONS
MARKING
A16 10 19 DQ4
A17 11 18 DQ3
CE 12 17 DQ2
OE 13 16 DQ1
Vss 14 15 WE
•
Timing
OE
Vss
15ns access (Contact factory)
20ns access
-15
-20
25ns access
-25
35ns access
-35
45ns access
55ns access
70ns access
-45
-55*
-70*
32-Pin LCC
32-Pin Flat Pack
•
Packages
A7
A8
A9
1
2
3
4
5
6
7
8
32
31
30
29
28
27
26
25
24
23
22
21
20
19
18
17
Vcc
A6
A5
A2
A4
4
3 2 1 32 31 30
Ceramic DIP (400 mil)
Ceramic Flat Pack
Ceramic LCC
Ceramic SOJ
Ceramic Quad LCC (Contact factory)
C
F
No. 109
No. 303
A6
5
6
7
8
9
29
28
27
26
25
24
23
22
21
A
A2
A82
A
A10
A11
A12
A10
A11
A13
NC
A14
A15
A16
A17
NC
CE
A5
A4
A94
A
A3
A131
N
A11
2
A4
A12
3
A3
A134
A2
A1
AC1
A3
A1
OE
A0
NC
A10
A145
A1 10
NA156
A0 11
NC
NC
CE
EC No. 207
DCJ No. 501
ECW No. 206
NC
NC
A0
NC
DQ4
DQ3
DQ2
DQ1
WE
NC
A0
DQ8
A167
9
C
N
E
C
12
NC
NC
DQ7
A17
10
11
12
13
14
15
16
O
D
E
Q1 13
DQ4
CE
14 1516 17 18 19 20
OE
Vss
•
•
2V data retention, low power standby
Radiation Tolerant (Epi)
L
E
*Electrical characteristics identical to those provided for the 45ns
access devices.
GENERAL DESCRIPTION
write enable ( WE) and CE inputs are both LOW. Reading
is accomplished when WE remains HIGH while CE and
OE go LOW. The devices offer a reduced power standby
mode when disabled.This allows system designs to achieve
low standby power requirements.
The Austin Semiconductor SRAM family employs high-
speed, low-power CMOS designs using a four transistor
memory cell. Austin Semiconductor SRAMs are fabricated
using double-layer metal, double-layer polysilicon tech-
nology.
The “L” version provides an approximate 50 percent
reduction in CMOS standby current (ISBC2) over the stan-
dard version.
All devices operate from a single +5V power supply and
all inputs and outputs are fully TTL compatible.
For flexibility in high-speed memory applications, Aus-
tin Semiconductor offers chip enable (CE) and output en-
able (OE) capability. These enhancements can place the
outputs in High-Z for additional flexibility in system
design. Writing to these devices is accomplished when
MT5C1005 883C
REV. 11/97
DS000005
Austin Semiconductor, Inc., reserves the right to change products or specifications without notice.
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